Light Emitting Device Package With Metallic Support Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light emitting device packages are complex in structure and large in size, limiting their efficiency and versatility in applications such as display devices and lighting systems.
Innovation Solution
A novel light emitting device package is developed with a simplified structure and reduced size, featuring a metallic support layer with alternating compressive and tensile stress metallic layers, an insulating layer, and a growth substrate, which enables efficient light emission and heat transfer, and can be integrated into a lighting system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If existing light emitting device packages are used, then light emission function is achieved, but structure becomes complex and size increases
Solution Approach 1:
The patent combines multiple functional layers (metallic support layer, insulating layer, growth substrate) into an integrated package structure that simplifies the overall device architecture while maintaining all necessary functions for light emission and heat management
Solution Approach 2:
The metallic support layer serves multiple functions simultaneously: providing mechanical support, managing heat dissipation, and enabling electrical connections, thereby reducing the need for separate dedicated components and simplifying the overall structure
2Volume of moving object
If existing light emitting device packages are used, then light emission function is achieved, but device size increases
Solution Approach 1:
The patent employs a nested layer structure where the insulating layer is positioned within the metallic support layer, and the growth substrate is integrated within the overall package, maximizing space utilization and minimizing device volume while maintaining structural integrity
Solution Approach 2:
The patent utilizes thin film structures for the insulating layer and metallic support layer, reducing the vertical thickness of the package while maintaining sufficient mechanical strength and functional performance
3Temperature
If metallic support layer with alternating stress layers is used, then heat management improves, but manufacturing complexity increases
Solution Approach 1:
The patent changes the stress state parameter of the metallic support layer by introducing alternating compressive and tensile stress layers, which improves heat management capabilities through controlled thermal expansion and contraction behavior
Solution Approach 2:
The patent employs composite material structure with alternating metallic layers having different stress characteristics, combining materials with complementary properties to achieve superior heat management while maintaining manufacturability through established deposition techniques
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a compact, reliable, and efficient light emitting device package that enhances light extraction and heat management, preventing degradation and improving the reliability of the device, while allowing for integration into various lighting systems.
Implementation Method 1
a metallic support layer with alternating compressive and tensile stress metallic layers
Implementation Method 2
a light emitting structure layer including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer
Data Source
Figure 1~3
Figure 4~5
Figure 6~8
AI summary
Disclosed are a light emitting device package, a method of manufacturing the same, and a lighting system. The light emitting device package includes a light emitting structure layer (50) including a first conductive semiconductor layer (20), an active layer (30) partially formed under the first conductive semiconductor layer (20), and a second conductive semiconductor layer (40) under the active layer (30), an insulating layer (60) disposed on lateral surfaces of the active layer (30) and the second conductive semiconductor layer (40) and partially disposed under the second conductive semiconductor layer (40), an electrode (80) disposed under the first conductive semiconductor layer (20) and electrically insulated from the active layer (30) and the second conductive semiconductor layer (40) by the insulating layer (60), and a metallic support layer (90) disposed under the second conductive semiconductor layer (40), the insulating layer (60), and the electrode (80) and including a first conductive region (91) electrically connected to the electrode (80), a second conductive region (92) electrically connected to the second conductive semiconductor layer (40), and an insulating region (93) disposed between the first and second conductive regions (91,92) and electrically insulating the first conductive region (91) from the second conductive region (92).