LED Package MIM Capacitor ESD Protection

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Solution Overview

Problem

Light emitting diodes (LEDs) are prone to damage from electrostatic discharge (ESD) and current crowding, which degrades their lifespan and reliability, and existing solutions like Zener diodes absorb light, while current crowding issues reduce light extraction efficiency.

Innovation Solution

A light emitting device package with a substrate, a light emitting structure, and a dielectric layer forming an MIM capacitor between electrodes to protect against ESD, reducing electric field intensity in the active layer and improving current spreading efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a Zener diode is mounted in a package to protect against ESD, then the LED is protected from electrostatic discharge damage, but the Zener diode absorbs light and reduces light quantity

Engineering Contradiction:
ImproveESD protectionVSAvoidlight quantity
Core Design Contradiction:
ReliabilityVSIllumination intensity

Solution Approach 1:

The patent extracts the ESD protection function from a separate Zener diode component and integrates it directly into the LED chip structure through a dielectric layer formed on the semiconductor layer. This eliminates the need for external ESD protection components that would block light, while maintaining ESD protection capability through the integrated capacitor structure.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the ESD protection function with the LED chip structure by forming a dielectric layer on the semiconductor layer to create an integrated capacitor. This combines the light-emitting function and ESD protection function into a single integrated structure, allowing both functions to coexist without light loss.

Inventive Principle:
Principle #5Merging (Combining)

2Productivity

If current flows through the LED structure, then light is emitted, but current crowding occurs which degrades lifespan and reliability

Engineering Contradiction:
Improvelight emissionVSAvoidlifespan
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent applies local quality by forming a dielectric layer in specific regions of the LED chip structure. The dielectric layer is formed on the semiconductor layer in regions where current crowding occurs, providing localized ESD protection and current spreading exactly where needed, rather than uniformly across the entire structure.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively protects LEDs from ESD without light loss, enhances light extraction efficiency, and improves current spreading, thereby extending the lifespan and reliability of the LEDs.

Implementation Method 1

a dielectric layer formed from a top surface of the second conductive semiconductor layer to an exposed top surface of the first conductive semiconductor layer

Methodology Applied
Scientific EffectCapacitance: Capacitance

Implementation Method 2

current flows in the reverse direction upon the electrostatic discharge (ESD) so that an active layer serving as a light emitting region may be damaged

Methodology Applied
Scientific EffectElectrostatic discharge: Electrostatic Discharge

Implementation Method 3

A light emitting device (LED) includes a p-n junction diode having a characteristic of converting electric energy into light energy

Methodology Applied
Scientific EffectLight emitting diode effect: Light Emitting Diode

Implementation Method 4

a light emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Data Source

PatentUS8878197B2Light emitting device, light emitting device package and lighting system
Publication Date: 2014.11.04 SUZHOU LEKIN SEMICON CO LTD
  • US8878197B2 patent drawing
  • US8878197B2 patent drawing
  • US8878197B2 patent drawing

AI summary

Disclosed are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a substrate; a light emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer, which are formed on the substrate such that a part of the first conductive semiconductor layer is exposed; a dielectric layer formed from a top surface of the second conductive semiconductor layer to an exposed top surface of the first conductive semiconductor layer; a second electrode on the second conductive semiconductor layer; and a first electrode on the exposed top surface of the first conductive semiconductor layer while making contact with a part of the dielectric layer on the second conductive semiconductor layer.