Multi-Resin LED Package Module for Luminous Efficiency

The patent extracts the harmful plastic material from the LED package module design. Instead of using plastic lenses and housings that yellow under UV exposure, the invention uses bare LED chips mounted on a substrate with metal heat dissipation structures, eliminating the material that causes luminous efficiency degradation while maintaining versatility in lighting applications

The patent employs composite material structures combining metal substrates with heat dissipation fins and ceramic or metal encapsulants. This composite approach replaces单一 plastic materials with a multi-material system that resists UV degradation, maintaining both functional versatility and high luminous efficiency over time

The patent merges the heat dissipation function directly into the substrate structure itself. The metal substrate integrates thermal conduction pathways and fin structures as an inherent part of the mounting platform, rather than adding separate heat sinks and thermal management components. This consolidation improves reliability through effective heat management while reducing overall device complexity

The metal substrate serves multiple functions simultaneously: it provides mechanical support for mounting LED chips, conducts heat away from the light-emitting elements, and acts as an electrical connection platform. This multi-functionality approach improves reliability through robust thermal and mechanical performance while avoiding the need for multiple separate components that would increase complexity