LED Package Protective Layer for Moisture Resistance
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Solution Overview
Problem
Conventional light-emitting device packages are prone to damage from moisture in high-temperature and high-humidity environments, particularly due to the migration of silver electrodes, which can compromise the insulation layer's integrity.
Innovation Solution
A light-emitting device package design that includes a protective layer extending from the top of the insulation layer to surround the bent portions, preventing moisture ingress and integrating with the second electrode, which can be made of the same material, to enhance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional insulation layer is disposed on the lateral side and top side of the light-emitting structure, then electrical insulation is provided, but the bent portion of the insulation layer is vulnerable to moisture damage in high-temperature and high-humidity environments
Solution Approach 1:
A protective layer is introduced as an intermediary element between the insulation layer and the external environment. This protective layer specifically covers the bent portion of the insulation layer, acting as a barrier that prevents moisture from reaching and damaging the insulation layer in high-temperature and high-humidity conditions.
Solution Approach 2:
The protective layer is applied in advance to the bent portion of the insulation layer before moisture damage can occur. This preliminary protective measure ensures that the insulation layer is pre-protected against moisture ingress in harsh environments, preventing degradation before it starts.
2Reliability
If the protective layer is integrated with the second electrode using the same material, then manufacturing complexity is reduced and reliability is enhanced, but the design flexibility is limited
Solution Approach 1:
The protective layer and the second electrode are merged into a single integrated structure using the same material. This combination simplifies the manufacturing process by reducing the number of separate layers and materials needed, while simultaneously enhancing reliability through improved adhesion and reduced interfaces where moisture could penetrate.
Data Source
AI summary
A light-emitting device package of embodiments comprises: a substrate; a light-emitting structure which is arranged below the substrate comprises a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a first electrode which is connected to the first conductive type semiconductor layer; a first insulation layer which is arranged on the side section of the light-emitting structure and the side and lower sections of the first electrode; a first pad which passes through the first insulation layer and is connected to the first conductive type semiconductor layer; a second electrode which passes through the first insulation layer, the first conductive type semiconductor layer and the active layer and is connected to the second conductive type semiconductor layer; a second pad which is connected to the second electrode; and a protective layer which extends from the top of the first insulation layer arranged on the side section of the light-emitting structure to the top of the first insulation layer arranged on the top of the first electrode, and is arranged so as to cover a bent part of the first insulation layer.