LED Package Mold with Inclined Surface for Delamination Prevention
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Solution Overview
Problem
Conventional LED packages experience delamination and separation issues due to physical forces during the separation of the lens mold, which can lead to reduced quality and lifespan, especially under severe environmental conditions.
Innovation Solution
A method for manufacturing an LED package that involves using molds with inclined inner surfaces and release coatings to minimize physical forces during separation, increasing the bonding surface area and reducing delamination by forming a molding portion and lens portion with specific resin materials that include fluorescent materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional lens mold is used to form the lens portion, then the lens portion can be formed on the molding portion, but physical forces during separation cause delamination at the interface between the lens portion and the molding portion
Solution Approach 1:
The lens mold is designed with a spherical curvature that matches the desired lens shape. The curved surface of the lens mold transfers the spherical form to the lens portion while distributing separation forces uniformly across the interface, preventing delamination during mold removal
Solution Approach 2:
The lens mold is pre-heated before contact with the lens material. This preliminary heating action ensures proper adhesion during forming and creates thermal expansion differences that facilitate clean separation after curing, preventing delamination during the separation process
2Ease of manufacture
If the lens mold is separated from the LED package, then the lens portion is formed, but physical forces during separation may cause delamination between the molding portion and the cavity
Solution Approach 1:
A release coating is applied to the lens mold surface that acts as an intermediary layer. This coating provides controlled adhesion during forming but allows easy separation afterward, preventing physical forces from transferring to the molding portion-cavity interface and causing delamination
Solution Approach 2:
The separation process utilizes temperature parameter changes - the lens mold is heated above the glass transition temperature of the lens material during forming, then cooled for separation. This parameter change modifies the adhesion characteristics, enabling clean separation without damaging the molding portion bonding
3Ease of manufacture
If conventional resin materials are used for the molding portion and lens portion, then the components can be formed, but delamination and separation may occur under severe environmental conditions
Solution Approach 1:
The patent uses composite resin materials with specific glass transition temperatures and adhesion properties. The molding resin and lens resin are selected as composite materials with complementary properties that ensure strong interfacial bonding while maintaining processability, preventing delamination under severe environmental conditions
Solution Approach 2:
The glass transition temperature of the resin materials is carefully controlled as a key parameter. By selecting resins with appropriate Tg values and controlling the curing temperature parameters, the patent optimizes the adhesion and mechanical properties of the resin components, ensuring they maintain bonding strength under severe environmental conditions while remaining manufacturable
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes delamination and separation among components, enhancing the quality and lifespan of the LED package by reducing physical forces and increasing bonding forces between the lens and molding portions.
Implementation Method 1
a mold configured to reduce a physical force operated to a lens portion during separation of the lens portion
Implementation Method 2
forming a molding portion by putting a molding resin in the cavity mounted with the LED chip, connecting a first mold disposed corresponding to the molding portion and formed with a through hole of which an inner surface is either linearly or non-linearly inclined, with respect to an upper surface of the package body, connecting a second mold having a mold pattern disposed corresponding to the through hole, to an upper surface of the first mold, forming a lens portion on the molding portion by putting a transparent resin in the through hole of the first mold and the mold pattern of the second mold
Data Source
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AI summary
A method for manufacturing a light emitting diode (LED) package is provided. The method includes preparing a package body including a first lead frame formed with a cavity and inserted on one side of a bottom surface of the cavity and a second lead frame inserted on the other side, mounting an LED chip on the bottom surface and electrically connecting the LED chip with the first lead frame and the second lead frame, forming a molding portion by a molding resin in the cavity, connecting, to the package body, a first mold corresponding to the molding portion and including a through hole having an inner surface linearly or non-linearly inclined, connecting a second mold to an upper surface of the first mold, forming a lens portion on the molding portion by a transparent resin, and separating the first mold and the second mold from the package body.