LED Package with Low Oxygen Permeability Molding for Narrow Spectrum Phosphors
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Solution Overview
Problem
White light emitting diode packages using yellow phosphors have low color rendition due to spectrum depletion in green and red regions, and phosphors with narrower full width at half maximum are vulnerable to moisture, affecting the reliability and luminous intensity of the package.
Innovation Solution
A light emitting diode package with a molding portion having low oxygen gas permeability and phosphors emitting green and red light with narrow full width at half maximum, coated with silane materials to prevent moisture contact, improving reliability and color reproducibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If phosphors with narrow full width at half maximum are used to improve color rendition, then color purity is improved, but moisture resistance deteriorates
Solution Approach 1:
The patent introduces an intermediate substance (encapsulating resin or coating layer) between the phosphor particles and the external environment. This intermediary layer acts as a barrier that prevents moisture from reaching the phosphor particles, thereby protecting the color purity of the emitted light while allowing the phosphor to maintain its narrow full width at half maximum characteristics.
Solution Approach 2:
The patent creates an inert environment by encapsulating the phosphor particles within a moisture-proof molding portion or coating layer. This inert environment isolates the phosphor from external moisture, preventing degradation of the phosphor's optical properties and maintaining high color purity over time.
2Device complexity
If conventional yellow phosphors are used to simplify the structure, then device complexity is reduced, but color rendition deteriorates
Solution Approach 1:
The patent merges multiple phosphor materials with different emission characteristics into a single composite phosphor layer. By combining phosphors that emit green light, red light, and yellow light, the system achieves high color rendition comparable to complex multi- phosphor systems while maintaining a relatively simple single-layer structure.
Solution Approach 2:
The patent uses composite phosphor materials that integrate multiple luminescent components within a single material system. This composite approach enables the phosphor layer to emit a broad spectrum including green and red regions, achieving high color rendition without requiring separate phosphor layers for each wavelength region.
3Ease of manufacture
If phosphors are exposed to moisture to maintain material accessibility, then ease of manufacture is improved, but luminous intensity deteriorates
Solution Approach 1:
The patent applies preliminary protective action by forming the encapsulating resin layer or coating on the phosphor particles before final assembly. This preliminary encapsulation prevents moisture ingress during subsequent manufacturing and usage processes, ensuring that the phosphor maintains its luminous intensity throughout the product lifecycle while still being accessible for initial processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The package achieves high color rendition with improved moisture resistance and long-term light retention, maintaining luminous intensity through the use of phosphors with narrow full width at half maximum and hydrophobic coatings.
Implementation Method 1
the coating layer includes a silane coating material... surfaces of the first phosphor and the second phosphor exhibit hydrophobic properties
Implementation Method 2
a first phosphor excited by the at least one light emitting diode chip to emit green light... a second phosphor excited by the at least one light emitting diode chip to emit red light
Data Source
AI summary
The present invention relates to a light-emitting diode package comprising a high-strength molding part. The light-emitting diode package, according to the present invention, comprises: a housing; at least one light-emitting diode chip disposed in the housing; a molding part which covers the at least one light-emitting diode chip; a first phosphor excited by the at least one light-emitting diode chip so as to emit green light; and a second phosphor excited by the at least one light-emitting diode chip so as to emit red light, wherein the molding part has an oxygen gas permeability of 140 cc/m2/day or less, and the second phosphor can emit red light having a full width at half maximum of 20 nm or less.