Multi-Barrier LED Package Sealing Against Elemental Ingress
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Solution Overview
Problem
Conventional LED packages face challenges in maintaining high light emission efficiency and durability due to adverse environmental exposure, leading to performance degradation from elemental ingress.
Innovation Solution
The implementation of multiple hermetic seals within LED packages, including bonding materials between cover structures and submounts, as well as coatings on LED chips and submounts, provides enhanced protection against environmental elements, forming a multi-barrier structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional single-seal structures are used in LED packages, then the device complexity is low and manufacturing is easier, but the reliability against environmental degradation is insufficient
Solution Approach 1:
The sealing structure is divided into multiple independent seal layers (first seal between cover and submount, second seal on LED chip, third seal on submount surface). Each seal performs a specific protective function, creating a segmented barrier system that enhances reliability against elemental ingress while maintaining manageable complexity through modular design
Solution Approach 2:
The sealing structure implements a nested arrangement where the second seal on the LED chip is positioned within the cavity formed by the first seal between the cover and submount. This nested configuration creates multiple concentric barriers, with each seal layer providing an additional level of protection without significantly increasing overall device footprint
2Reliability
If multiple hermetic seals are implemented to prevent elemental ingress, then the reliability and protection against environmental degradation improve, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The second seal is applied to the LED chip and submount surfaces before the final assembly step, creating a pre-established barrier that simplifies the overall manufacturing process. By preparing the sealing surfaces in advance, the process avoids complex post-assembly sealing operations and ensures proper seal formation before final encapsulation
Solution Approach 2:
Different seal materials and configurations are applied to specific locations based on local requirements: the first seal uses bonding materials suitable for cover-to-submount attachment, while the second seal uses coatings optimized for LED chip surface protection. This localized approach allows each seal to be manufactured using the most appropriate process for its specific function
Data Source
AI summary
Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly sealing structures for LED packages are disclosed. Sealing structures include multiple seals within an LED package that provide a multiple barrier structure for enhanced protection from elemental ingress from a surrounding environment. Certain seals may be provided as bonding materials between cover structures and submounts of LED packages, thereby enclosing LED chips. Additional seals may be provided as coatings on surfaces of LED chips and/or submounts that are between cover structures and LED chips. Sealing structures may include multiple levels of hermetic seals with LED packages.