LED Package Metallic Nanoparticle Electrical Isolation
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Solution Overview
Problem
Conventional LED package structures face challenges in achieving efficient electrical isolation without increasing material costs or complicating the manufacturing process, as they require additional insulation materials or modified package structures to prevent electric short-circuits.
Innovation Solution
A structure utilizing metallic nanoparticles with diameters smaller than 10 nm, which cover the base and side surfaces of an accommodating space in the LED package, providing both light reflection/scattering and electrical isolation, eliminating the need for extra insulation materials or circuit modifications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional insulation materials are added to prevent electric short-circuits, then electrical isolation is improved, but material cost increases
Solution Approach 1:
The patent extracts the electrical isolation function from separate insulation materials and integrates it into the metallic holder structure itself. By designing the holder with specific geometric features (such as isolated metallic regions or structural separations), the holder inherently provides electrical isolation between the extended electrode and other conductive parts, eliminating the need for additional insulation materials and reducing material cost.
Solution Approach 2:
The metallic holder is designed to serve multiple functions simultaneously: it provides mechanical support for the LED chip, reflects and focuses light to enhance lighting efficiency, and provides electrical isolation between conductive components. This multi-functionality eliminates the need for separate insulation materials, reducing both material cost and manufacturing complexity.
2Reliability
If additional electrical circuits are added for electrical isolation, then electrical isolation is improved, but manufacturing complexity increases
Solution Approach 1:
The patent removes the need for additional electrical circuits for isolation by integrating the isolation function directly into the metallic holder's structure. The holder's geometric design (such as physically separated metallic regions or strategic placement of conductive elements) inherently prevents electrical short-circuits, eliminating complex manufacturing processes required for adding separate isolation circuits.
Solution Approach 2:
The electrical isolation function is merged with the structural support and light reflection functions of the metallic holder. By combining multiple functions into a single component, the patent simplifies the overall device structure and manufacturing process, avoiding the need for separate isolation circuits and their associated complex assembly steps.
3Reliability
If the package structure is dramatically modified for electrical isolation, then electrical isolation is improved, but manufacturing efficiency decreases
Solution Approach 1:
The metallic holder is designed to provide multiple functions (mechanical support, light reflection, and electrical isolation) within its standard structure. By making the holder itself multi-functional, the patent avoids dramatic modifications to the package structure while still achieving reliable electrical isolation, thereby maintaining high manufacturing efficiency.
Solution Approach 2:
The patent applies local quality modifications to the metallic holder, such as creating specific geometric features or surface treatments in particular regions to provide electrical isolation. These localized modifications are minimal and can be easily integrated into existing manufacturing processes, avoiding dramatic structural changes that would reduce manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces costs, and enhances light focusing and scattering efficiency while preventing electric short-circuits, thereby improving the LED package's performance and longevity.
Implementation Method 1
light emitted from the LED unit is reflected or scattered by the metallic nanoparticles
Implementation Method 2
light emitted from the LED unit is reflected or scattered by the metallic nanoparticles
Implementation Method 3
each of the metallic nanoparticles has a diameter smaller than 10 nm and is electrically isolated
Data Source
AI summary
A LED (Light-Emitting Diode) package structure is provided. The LED package improved structure includes a base, a plurality of metallic nanoparticles and a LED unit. The base has an accommodating space, wherein the accommodating space has a bottom surface and at least one side surface surrounding the bottom surface. The metallic nanoparticles cover the bottom surface and/or the side surface. The LED unit is disposed in the accommodating spare, in which light emitted from the LED unit is reflected or scattered by the metallic nanoparticles, each of the metallic nanoparticles has a diameter smaller than 10 nm and is electrically isolated.