Light Emitting Device Package Without TFT Substrate
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional display devices require separate thin film transistor (TFT) substrates, which increase manufacturing costs and limit the thickness reduction of ultra-thin display panels.
Innovation Solution
A light emitting device package is designed without a separate TFT substrate, featuring a cell array with semiconductor light emitting units, wavelength conversion units, and switching units within a partition structure, allowing for selective driving of semiconductor light emitting units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a separate TFT substrate is used in conventional display devices, then the light emitting units can be controlled, but the manufacturing cost increases and the panel thickness cannot be reduced
Solution Approach 1:
The patent merges the TFT substrate function with the light emitting device package by integrating switching units directly into the package structure. The switching units are formed on the same substrate as the light emitting units, eliminating the need for a separate TFT substrate while maintaining the ability to selectively control each light emitting unit. This integration reduces both manufacturing cost and structural complexity.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it acts as both the growth substrate for light emitting units and as the base for forming switching units. The partition structure also serves dual purposes by both separating wavelength conversion units and providing a mounting structure for switching units. This multi-functionality reduces the overall number of components and simplifies the device architecture.
2Length of moving object
If a separate TFT substrate is used, then control over light emitting units is achieved, but the panel thickness is increased
Solution Approach 1:
The switching units are integrated into the light emitting device package on the same substrate, eliminating the need for a separate TFT substrate layer. This merging of control functionality into the existing package structure directly reduces the overall panel thickness while preserving the ability to selectively drive individual light emitting units through the switching units.
3Area of stationary object
If wavelength conversion units are placed close together, then the device area is reduced, but light interference between units increases
Solution Approach 1:
The patent introduces partition structures as intermediary elements between adjacent wavelength conversion units. These partitions act as light-blocking barriers that prevent light from one wavelength conversion unit from interfering with adjacent units. The partitions are positioned to extend from the substrate upward, creating effective light isolation while occupying minimal space, thus enabling close placement of wavelength conversion units without significant light interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces manufacturing costs and enables the production of ultra-thin display panels by eliminating the need for a separate TFT substrate, while maintaining control over the light emitting units.
Implementation Method 1
a plurality of wavelength conversion units disposed on the first surface of the cell array to correspond to the plurality of semiconductor light emitting units, respectively, each configured to convert a wavelength of light, emitted by a respective one of the plurality of semiconductor light emitting units, into a different wavelength of light
Data Source
AI summary
A light emitting device package includes a cell array including a plurality of semiconductor light emitting units, and having a first surface and a second surface opposite the first surface, each of the plurality of semiconductor light emitting units having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer stacked on each other. The light emitting device package may further include a plurality of wavelength conversion units disposed on the first surface of the cell array to correspond to the plurality of semiconductor light emitting units, respectively, each configured to convert a wavelength of light, emitted by a respective one of the plurality of semiconductor light emitting units, into a different wavelength of light, and a partition structure disposed in a space between the plurality of wavelength conversion units, and a plurality of switching units spaced apart from the plurality of wavelength conversion units within the partition structure, and electrically connected to the plurality of semiconductor light emitting units.