LED Package Structure With Dual Optical Layers for Miniaturization
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Solution Overview
Problem
Conventional LED packaging designs with four white walls limit light emitting efficiency and restrict miniaturization, hindering the development of compact end products.
Innovation Solution
A light emitting device and module design featuring a base with through holes and conductive units, including chip bonding and solder pads, connected via first connections, and a package with two distinct optical properties, allowing for miniaturization and enhanced light emitting efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional packaging with four white walls is used, then structural simplicity is maintained, but light emitting efficiency is limited and device size cannot be miniaturized
Solution Approach 1:
The package structure is segmented into multiple functional layers: a reflective package body (first package body) and a transparent package body (second package body), each serving distinct optical functions. This segmentation allows optimized light management while maintaining structural organization, resolving the contradiction between improved light emitting efficiency and structural complexity.
Solution Approach 2:
The patent employs a nested package structure where the transparent package body (second package body) encloses the reflective package body (first package body), which in turn encloses the light emitting chip. This nested arrangement enables compact miniaturization while preserving the functional benefits of multiple optical layers, thereby improving light emitting efficiency without excessive complexity increase.
2Length of moving object
If conventional packaging design is used, then manufacturing simplicity is maintained, but device size is restricted and miniaturization is hindered
Solution Approach 1:
The patent transitions from conventional two-dimensional planar packaging to a three-dimensional nested structure with vertical layering. The reflective and transparent package bodies are arranged in stacked layers around the light emitting chip, enabling compact size reduction in the horizontal plane while utilizing the vertical dimension for optical function separation, thus achieving miniaturization with manageable manufacturing complexity.
Solution Approach 2:
The package structure combines materials with different optical properties: a reflective material for the first package body and a transparent material for the second package body. This composite material approach enables optimized light extraction and emission while maintaining a compact form factor, balancing miniaturization goals with manufacturing feasibility through established material bonding techniques.
Data Source
AI summary
A light emitting device and a light source module are provided. The light emitting device includes a base, a conductive unit, a light unit, and a package. The base includes a first substrate and n through holes, and the through holes pass through the first substrate. The conductive unit includes m conductors that are separate from each other, and the conductors pass through the first substrate. The light unit is electrically connected to the conductors. The package includes a first package body surrounding the light unit and a second package body covering the light unit and the first package body. The first package body and the second package body have different optical properties. Furthermore, m and n are integers greater than or equal to 2, and m is greater than or equal to n.