LED Package Partition Wall Thermal Optical Separation
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Solution Overview
Problem
Conventional light emitting diode (LED) packages face challenges in heat dissipation and light interference due to the close proximity of light emitting devices, leading to reduced efficiency and lifespan, and potential wire breakage from high installation heights.
Innovation Solution
The design incorporates a body with first and second reflection cups spaced apart, a partition wall between them, and connection pads, allowing for thermal and optical separation of light emitting devices, improved heat dissipation, and reduced wire breakage through strategic placement and material selection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If light emitting devices are placed close together to increase device density, then productivity is improved, but heat dissipation deteriorates and light interference occurs
Solution Approach 1:
The patent divides the package into multiple cavities separated by partition walls, with each cavity containing a light emitting device. This segmentation isolates heat from each device into its own cavity space, preventing heat accumulation that would occur in high-density configurations without partitioning.
Solution Approach 2:
The patent utilizes vertical spacing between the substrate and the package top surface to create additional thermal management space. Heat dissipation paths are extended in the vertical dimension through the cavity structures, allowing heat to dissipate away from the dense horizontal arrangement of devices.
2Productivity
If light emitting devices are placed close together to increase device density, then productivity is improved, but light extraction efficiency deteriorates due to light interference
Solution Approach 1:
Partition walls divide the package into separate cavities, isolating the optical fields of adjacent light emitting devices. This prevents light interference between closely spaced devices while maintaining high device density, thereby preserving light extraction efficiency.
3Reliability
If installation height is increased to reduce wire breakage, then reliability is improved, but device complexity increases
Solution Approach 1:
The partition walls create separate cavities that naturally position and protect wire connections. This segmented structure allows for optimized wire routing within each cavity, reducing wire stress and breakage risk without requiring excessive vertical height.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances light extraction efficiency, prevents light interference, and extends the lifespan of the LED package by effectively managing heat and reducing wire breakage risks.
Implementation Method 1
A light emitting device, for example, a light emitting diode is a type of semiconductor device that can convert an electric energy into a light
Implementation Method 2
first and second reflective cups spaced apart from each other in a top surface of the body
Data Source
AI summary
A light emitting device package is disclosed. The light emitting device package includes a body, first and second reflection cups spaced apart from each other in a top surface of the body, a first connection pad disposed in the top surface of the body, spaced apart from the first and second reflection cups, a first light emitting diode mounted in the first reflection cup, a second light emitting diode mounted in the second reflection cup, and a partition wall disposed between the first reflection cup and the second reflection cup, the partition wall extended from the top surface of the body upwardly.