LED Package Partition Walls for Color Coordinate Consistency
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Solution Overview
Problem
Mass-produced LED packages exhibit variations in color coordinates due to inconsistent filler heights and refractive indexes, leading to increased manufacturing costs and design complexities.
Innovation Solution
An LED package design featuring a base with partition walls and a groove system that allows uniform filler distribution and curing, enabling the production of LED packages with varying thickness using a single lead frame, and a method involving screen members for precise filler placement and curing to minimize thermal deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If filler is injected into each bucket individually using a dispenser, then LED packages can be manufactured in mass production, but the filler height varies in each package leading to color coordinate variations
Solution Approach 1:
Multiple buckets are merged into a single mold cavity system where filler is injected once to fill all buckets simultaneously. This combines multiple individual filling operations into one unified process, ensuring consistent filler height across all packages while maintaining mass production efficiency.
Solution Approach 2:
The mold cavity system serves multiple functions: it defines the filler volume for each bucket, provides structural support during curing, and ensures uniform filler distribution across all packages. This multi-functional design eliminates the need for individual filler injection into each bucket.
2Ease of manufacture
If the third and fourth partition walls are made thinner to reduce material usage, then manufacturing costs decrease, but the partition walls deform during high-temperature curing leading to filler height variations
Solution Approach 1:
The partition walls are constructed using composite material structure that combines adequate thickness for structural integrity with optimized material composition. This ensures the walls can withstand high-temperature curing without deformation while maintaining reasonable material usage.
Solution Approach 2:
The thickness parameters of the partition walls are optimized to balance structural stability during curing with material efficiency. The walls are designed with sufficient thickness to resist thermal deformation while minimizing material consumption.
3Adaptability or versatility
If different lead frames are designed for LED packages with varying thickness, then each package type can be optimized, but manufacturing costs and design complexity increase
Solution Approach 1:
A single lead frame design is created that can accommodate LED packages of varying thicknesses. The lead frame incorporates adjustable or flexible structural elements that adapt to different package thickness requirements, eliminating the need for multiple specialized lead frame designs.
Solution Approach 2:
The lead frame incorporates dynamic or adjustable components that can adapt to different package thicknesses. This may include flexible mounting structures or adjustable clamping mechanisms that maintain proper electrical and mechanical connections regardless of the specific package thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures uniform filler heights across LED packages, reducing color coordinate variations and allowing for efficient production of LED packages with varying thicknesses, thereby reducing manufacturing costs and improving product consistency.
Implementation Method 1
a filling part filling in a space formed by the mounting portion and the partition walls at both opposite sides and transmitting light generated from the LED chip
Implementation Method 2
The partition walls may include a reflective film to reflect light generated from the LED chip
Implementation Method 3
light emitting diode (LED) packages that include LEDs to generate light emission according to electrical signals
Data Source
AI summary
The present invention relates to light emitting diode (LED) packages and methods of manufacturing the same, and more particularly, to an LED package and a method of manufacturing the same that can reduce a variation of color coordinates of mass-produced LED packages.