LED Package with Phosphor Shrink Sleeve and Conductive Adhesive
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Solution Overview
Problem
Current methods for manufacturing LED sticks, strings, or straws face challenges such as low yields due to stress from chip-shooter placement and wire bonding, and difficulties in applying yellow phosphor coatings to elongated structures, which affect light emission and lifespan.
Innovation Solution
The method involves attaching LED die chips or packages to adjoining frames with electrical connections, encapsulating them in a solid enclosure with a heat-activated shrink wrap sleeve coated with yellow phosphor, and using heat transfer gases to manage heat dissipation, allowing for efficient power distribution and uniform light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If individual packaged LEDs are placed in the stick using chip-shooter and wire bonding, then electrical connections are established, but significant stresses are caused to the package resulting in low yields
Solution Approach 1:
The patent merges the LED chip placement and electrical connection processes by using conductive adhesive to simultaneously attach the LED chip and establish electrical connection, eliminating the separate wire bonding step that causes mechanical stress and yield loss
Solution Approach 2:
The patent extracts the wire bonding operation from the manufacturing process, replacing it with direct chip mounting using conductive adhesive, thereby removing the source of significant mechanical stress that leads to package failure and low yields
2Illumination intensity
If yellow phosphor coating is applied to elongated LED string structure, then white light emission is achieved, but the coating is hard to apply uniformly
Solution Approach 1:
The patent segments the phosphor coating application by pre-coating the phosphor on individual LED chip packages before assembly, rather than attempting to coat the entire elongated string structure, making the manufacturing process much more manageable and uniform
Solution Approach 2:
The patent performs the phosphor coating operation preliminarily on individual LED packages before final assembly, ensuring uniform coating coverage is achieved on small, manageable components rather than on the complete elongated structure
3Power
If heat is generated from the LED chip, then light emission occurs, but dislocation and mismatch occur in the crystal structure reducing brightness and lifespan
Solution Approach 1:
The patent introduces a conductive adhesive as an intermediary material between the LED chip and the substrate, which serves as a thermal interface material to efficiently conduct heat away from the crystal structure while maintaining electrical connection, preventing thermal damage to the LED chip
Solution Approach 2:
The patent extracts heat from the LED chip through direct thermal conduction via the conductive adhesive to the substrate, removing excess heat before it can cause dislocation and mismatch in the crystal structure, thereby preserving LED reliability and lifespan
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances yield and light quality by reducing stress on LED components, ensuring effective heat management, and simplifying the application of phosphor coatings, resulting in improved light output and extended lifespan.
Implementation Method 1
each said LED die chip is surrounded by a heat-activated shrink wrap sleeve coated with the appropriate yellow phosphor material
Implementation Method 2
heat-activated shrink wrap sleeve
Implementation Method 3
using heat transfer gases to manage heat dissipation
Data Source
AI summary
The present invention relates to a new method, system and apparatus for light emitting diode (LED) packages. An object of the present invention is to provide an LED package having reduced components, a superior heat dissipation property and a compact structure, does not largely restrict use of conventional equipment for its manufacture, and is compatible with implementation within present illumination devices packaging.