LED Package Substrate Plasma Treatment Adhesion
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Solution Overview
Problem
The existing LED packages face issues with inadequate adhesion strength between the resin-molded part and the package substrate, leading to potential separation under temperature changes and moisture penetration, which affects the reliability and durability of the device.
Innovation Solution
A method involving plasma-treating or heat-treating the package substrate to reform the surface, enhancing the adhesion between the resin-molded part and the substrate, specifically using plasma treatment with inert gases at 700 W to 1500 W for 1 to 3 hours or heat treatment at 300° C to 400° C, to improve bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the resin-molded part and package substrate are bonded directly without surface treatment, then the manufacturing process is simple, but the adhesion strength at the interface is weak
Solution Approach 1:
The patent applies preliminary surface treatment (plasma or heat treatment) to the package substrate before bonding the resin-molded part. This preliminary action modifies the substrate surface properties in advance to enhance adhesion strength, resolving the contradiction between simple manufacturing and strong bonding by adding a preparatory step that pays off in improved joint strength.
Solution Approach 2:
The patent changes physical parameters of the substrate surface through plasma treatment (introducing surface groups, increasing surface energy) or heat treatment (modifying surface morphology). These parameter changes improve the chemical and physical bonding characteristics between the substrate and resin-molded part, thereby increasing adhesion strength while maintaining process efficiency.
2Temperature
If the package substrate uses heterogeneous material (e.g., silicon) with good heat conductivity, then thermal management is improved, but adhesion strength with resin-molded part deteriorates
Solution Approach 1:
The patent applies local surface treatment only to the bonding interface area of the silicon substrate where the resin-molded part will be attached. This local quality change improves adhesion at the critical interface while preserving the bulk thermal conductivity properties of the silicon material, thus resolving the contradiction between heat management and bonding strength.
Solution Approach 2:
The patent modifies surface parameters (surface energy, roughness, chemical composition) of the silicon substrate through plasma or heat treatment without changing the bulk material properties. This allows the substrate to maintain its excellent thermal conductivity while achieving improved adhesion strength at the bonding interface.
3Reliability
If the interface between resin-molded part and substrate is weak, then manufacturing is easier, but reliability deteriorates due to moisture penetration and separation under temperature changes
Solution Approach 1:
The patent performs preliminary surface treatment to enhance interface adhesion before assembly, preventing future reliability issues such as moisture penetration and thermal separation. This preliminary action ensures long-term reliability without significantly complicating the manufacturing process.
Solution Approach 2:
The patent changes surface parameters to improve bonding characteristics, creating a more reliable interface that resists moisture penetration and thermal stress. The treatment modifies surface energy and morphology to ensure durable adhesion, thereby improving reliability while maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly improves adhesion strength, thermal stability, and reduces moisture absorption, resulting in a more reliable LED package with enhanced durability and performance.
Implementation Method 1
plasma-treating the package substrate to reform at least a predetermined surface area of the package substrate where a resin-molded part will be formed
Implementation Method 2
heat-treating the package substrate in an atmosphere of inert gas at a temperature ranging from about 300° C. to 400° C. for 1 to 3 hours in order to reform at least a predetermined surface area of the package substrate
Data Source
AI summary
The invention relates to an LED package and proposes a method of fabricating an LED package including steps of providing a package substrate having a mounting area of an LED and a metal pattern to be connected with the LED, and plasma-treating the package substrate to reform at least a predetermined surface area of the package substrate where a resin-molded part will be formed. The method also includes mounting the LED on the mounting area on the substrate package and electrically connecting the LED with the metal pattern, and forming the resin-molded part in the mounting area of the LED to seal the LED package.