LED Package Lead Frame Layout for Reliable Probe Contact

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Solution Overview

Problem

Typical side-view type light emitting diode packages have opposite polarity terminals that are narrow and close together, leading to contact failures with probes during testing, and also have thin elongated connecting portions that limit the area for electrical connection to external components.

Innovation Solution

A light emitting diode package with single-polarity terminals on opposite side surfaces of a package substrate, providing a larger contact area to prevent probe contact failures and short circuits, and allowing for reliable electrical connection through the increased surface area.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If opposite polarity terminals are placed close together on one side, then the package structure is compact, but probe contact reliability deteriorates

Engineering Contradiction:
Improveterminal areaVSAvoidprobe contact reliability
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The patent divides the terminal arrangement into separate segments: positive terminals are located on one side surface of the package and negative terminals on the opposite side surface. This segmentation increases the distance between opposite polarity terminals and provides larger, more widely separated contact areas for probes, thereby improving probe contact reliability while maintaining compact packaging.

Inventive Principle:
Principle #1Segmentation

2Length of moving object

If connecting portions are made thin and elongated, then the package size is reduced, but electrical connection area to external components is insufficient

Engineering Contradiction:
Improvepackage sizeVSAvoidelectrical connection area
Core Design Contradiction:
Length of moving objectVSArea of stationary object

Solution Approach 1:

The patent extends the connecting portions not only in the lateral direction but also in the thickness direction of the package substrate. This multi-dimensional extension allows the connecting portions to provide sufficient electrical connection area to external components while keeping the overall package footprint compact, effectively resolving the contradiction between package size and connection area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12211958B2Light emitting diode package having lead frame with groove thereof
Publication Date: 2025.01.28 SEOUL SEMICONDUCTOR
  • US12211958B2 patent drawing
  • US12211958B2 patent drawing
  • US12211958B2 patent drawing

AI summary

A light emitting diode package includes a body part having a cavity at the upper part thereof and having a long shape in one direction; and a first lead frame and a second lead frame which are coupled to the bottom of the body part and spaced apart from each other in a transverse direction. The first lead frame includes a first mounting part exposed in the cavity; a first terminal part exposed to one side surface of the body part; and a first connection part exposed to the lower surface of the body part. The second lead frame includes a second mounting part exposed in the cavity; a second terminal part exposed to the other side surface of the body part along a one-side direction; and a second connection part exposed to the lower surface of the body part.