Light Emitting Device Package With Protruding Frames
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Solution Overview
Problem
Current semiconductor device packages face challenges in improving light extraction efficiency, electrical properties, and manufacturing costs, while also experiencing issues with bonding strength and re-melting during re-bonding to circuit boards.
Innovation Solution
The design incorporates a light emitting device package with protruding portions on frames facing bonding areas, conductive layers, and resins with different reflection properties, enhancing light extraction efficiency and electrical properties, and a new package structure to reduce manufacturing costs and prevent re-melting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional semiconductor device packages are used, then manufacturing processes are simple, but light extraction efficiency is poor
Solution Approach 1:
The frame is divided into multiple protruding portions that correspond to different bonding portions of the light emitting device. Each protruding portion can be independently configured with conductive layers, allowing for optimized electrical connections without complicating the overall manufacturing process
Solution Approach 2:
The package structure transitions from a flat two-dimensional configuration to a three-dimensional structure with protruding portions extending upward from the frame. This dimensional change enables better light extraction by creating multiple surfaces and angles for light emission while maintaining manufacturing feasibility
2Ease of manufacture
If conventional package structures are used, then manufacturing costs are low, but bonding strength is insufficient and re-melting occurs
Solution Approach 1:
Conductive layers are pre-formed on the protruding portions of the frame before the light emitting device is bonded to the frame. This preliminary action ensures proper electrical connections are established in advance, preventing bonding defects and reducing the risk of re-melting during subsequent processing
Solution Approach 2:
The protruding portions act as intermediary structures between the frame and the bonding portions of the light emitting device. These protrusions provide additional surface area and mechanical leverage for bonding, enhancing bonding strength without significantly increasing manufacturing complexity
3Reliability
If light extraction efficiency is improved through structural modifications, then device performance increases, but device complexity increases
Solution Approach 1:
The protruding portions serve multiple functions simultaneously: they provide mechanical support for bonding, establish electrical connections through integrated conductive layers, and enhance light extraction through their three-dimensional geometry. This multi-functionality improves device performance without proportionally increasing structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves light extraction efficiency, electrical properties, and manufacturing yield, while preventing re-melting during re-bonding and reducing manufacturing costs by using a novel package structure with protruding portions, conductive layers, and resins.
Implementation Method 1
a conductive layer around a bottom of the protruding portion
Implementation Method 2
resins with different reflection properties, enhancing light extraction efficiency
Data Source
AI summary
The light emitting device package disclosed in the embodiment includes first and second frames spaced apart from each other; a body disposed between the first and second frames; a light emitting device including a first bonding portion and a second bonding portion on a lower portion thereof; and a first resin disposed between the body and the light emitting device, wherein the first frame includes a first protruding portion facing the first bonding portion of the light emitting device, and the second frame includes a second protruding portion facing the second bonding portion of the light emitting device, and including a first conductive layer between the first bonding portion and the first protruding portion and a second conductive layer between the second bonding portion and the second protruding portion.