LED Package Structure With Protrusion Portions For Structural Integrity
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Solution Overview
Problem
The existing LED packaging processes often compromise the structural strength and yield of LED packages due to the conventional cutting methods that can damage the lead frame, leading to reliability issues and increased tool wear.
Innovation Solution
A novel LED packaging structure and process involving a lead frame with specific hole patterns, where base molds are molded over the lead frame, and a punching and cutting process is used to create protrusion portions and separate the packages without cutting the lead frame, enhancing structural strength and reducing tool wear.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional cutting methods are used to separate LED packages, then productivity is improved, but the lead frame is damaged leading to reduced reliability and yield
Solution Approach 1:
The lead frame is designed with pre-defined separation lines and perforations that allow clean segmentation into individual packages without damaging the overall structure. The cutting process follows these pre-established segmentation paths, ensuring both high productivity and lead frame integrity.
Solution Approach 2:
Perforations and separation lines are created in the lead frame before the final cutting process. This preliminary action prepares the lead frame for clean separation, preventing damage during the cutting operation while maintaining high production efficiency.
2Speed
If conventional cutting methods are used to separate LED packages, then manufacturing speed is increased, but tool wear increases due to cutting the lead frame
Solution Approach 1:
The lead frame sections to be separated are extracted or removed before the final cutting operation. By taking out the portions that would otherwise require cutting, the main cutting tool only needs to cut through the mold material, significantly reducing tool wear while maintaining high cutting speed.
Solution Approach 2:
Perforations and preliminary cuts are made in the lead frame before the main cutting operation. This preliminary action reduces the amount of material the main cutting tool must remove, decreasing tool wear and extending tool life while maintaining production speed.
3Productivity
If the lead frame is cut during package separation, then package division is achieved, but structural strength of the packages is reduced
Solution Approach 1:
The package separation is achieved by segmenting along pre-defined separation lines in the mold, not by cutting the lead frame itself. This segmentation approach allows efficient package division while preserving the complete lead frame structure within each package, maintaining structural integrity.
Solution Approach 2:
The mold structure acts as an intermediary that facilitates package separation. By cutting the mold material rather than the lead frame, and using the lead frame's own perforations as separation guides, the process achieves efficient package division without compromising lead frame strength.
Data Source
AI summary
An LED package structure includes a first metal plate, a second metal plate, and a mold. The first metal plate has at least one first protrusion portion. The second metal plate has at least one second protrusion portion. The mold is disposed on the first metal plate and the second metal plate, in which the mold has a first side surface, a second side surface opposite to the first side surface, a third side surface, and a fourth side surface opposite to the third side surface. The first and second protrusion portion protrude respectively from the first side surface and the second side surface, and the first metal plate and the second metal plate are covered by the third side surface and the fourth side surface, in which a portion of the first side surface between the first edge and the first protrusion portion is a fracture surface.