LED Package with Patterned Sapphire Substrate and Recessed Sealing
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Solution Overview
Problem
Conventional light emitting diode packages with flip-chip type structures have complex designs, leading to high manufacturing costs and complicated processes, and they often suffer from low light extraction efficiency due to total reflection within the growth substrate.
Innovation Solution
A simplified light emitting diode package design at the chip level with a patterned sapphire substrate (PSS) and a semiconductor structure layer, where the growth substrate has a suitable thickness and PSS pattern to minimize light reflection and enhance light extraction, and the package substrate includes a trench for direct chip-substrate bonding without a glass member, optimizing light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a glass member and walls are used to seal the light emitting diode chip, then the sealing reliability is improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the sealing function into the package substrate itself by forming a recess that directly receives and seals the light emitting diode chip. The package substrate integrates both the mounting function and the sealing function, eliminating the need for separate glass members and walls, thus reducing structural complexity while maintaining sealing reliability.
Solution Approach 2:
The patent extracts and removes the glass member and walls from the package structure. By using the package substrate's recess to provide both mechanical support and sealing, the unnecessary components (glass member and walls) are eliminated, simplifying the overall structure while maintaining the essential sealing function.
2Reliability
If a typical light emitting diode package structure with multiple components is used, then the sealing function is achieved, but the manufacturing process becomes complicated and costly
Solution Approach 1:
The patent combines multiple functions (mounting, sealing, and structural support) into a single package substrate component. The recess in the package substrate simultaneously provides mechanical support for the chip and seals the light emitting diode device, reducing the number of manufacturing steps and assembly operations required.
Solution Approach 2:
The patent removes the glass member from the manufacturing process entirely. By using the package substrate's recess to provide sealing functionality, the complex processes of glass member attachment, alignment, and sealing are eliminated, significantly simplifying the manufacturing process.
3Illumination intensity
If the growth substrate has a large thickness, then the light extraction efficiency is improved, but the total internal reflection increases
Solution Approach 1:
The patent applies a patterned sapphire substrate structure where the bottom surface of the growth substrate is locally modified with patterns (such as holes or grooves). This local quality change allows light to escape more efficiently at specific locations while maintaining the overall structural integrity and thickness of the substrate, thereby improving light extraction efficiency without excessive total internal reflection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design results in a simpler manufacturing process, reduced costs, and significantly improved light extraction efficiency by minimizing internal reflections and eliminating the need for a glass member, thereby enhancing the luminous efficacy of the light emitting diode package.
Implementation Method 1
they often suffer from low light extraction efficiency due to total reflection within the growth substrate
Data Source
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AI summary
According to the present invention, a light-emitting diode package comprises: a substrate for growth; a passivation layer formed on a surface of one side of the substrate for growth; and a package substrate having a main body portion and a wall portion, wherein the wall portion is formed on the main body portion. At least the space formed among the main body portion, the wall portion and the passivation layer is sealed from the outside.