LED Package Quartz Plate Sealing for Consistent Light Color
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Solution Overview
Problem
Existing LED packaging structures suffer from inconsistent light color due to refractive index mismatch between potting glue and air, leading to total reflection and color deviation, and they have complex structures, poor waterproof reliability, and reduced service life.
Innovation Solution
An LED packaging structure with a quartz plate having a flat surface forms an air separation layer between the fluorescent glue and the potting glue, preventing direct contact and ensuring consistent light reflection, while using a simple design for improved waterproofing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If potting glue is directly in contact with fluorescent glue body, then waterproof structure is simple, but light color consistency deteriorates due to total reflection and refractive index mismatch
Solution Approach 1:
The invention introduces an air separation layer as an intermediary between the fluorescent glue body and the potting glue. This air layer acts as a mediator that prevents direct contact between the two glues, thereby eliminating the total reflection phenomenon and refractive index mismatch that cause light color deviation. The air separation layer is formed by the quartz plate pressing against the fluorescent glue body during packaging, creating a stable air gap that maintains optical consistency while allowing the simple waterproof structure to function.
2Reliability
If shell structure with sealing ring and sealant is used for waterproofing, then waterproof reliability improves, but structure complexity increases and assembly efficiency decreases
Solution Approach 1:
The invention merges the waterproof sealing function with the existing LED packaging components. The quartz plate, which is already part of the packaging structure, serves dual purposes: it provides the air separation layer for optical consistency and simultaneously acts as the waterproof seal when combined with the potting glue. The potting glue is applied to seal between the quartz plate and the support, eliminating the need for separate sealing rings and sealants. This integration maintains high waterproof reliability while significantly simplifying the overall structure and improving assembly efficiency.
3Manufacturing precision
If quartz plate with air separation layer is added, then light color consistency improves, but structure complexity increases
Solution Approach 1:
The quartz plate is designed to perform multiple functions simultaneously: it provides the air separation layer that ensures light color consistency, acts as a sealing surface for waterproofing when combined with the potting glue, and serves as a structural component of the packaging. By making the quartz plate multi-functional, the invention avoids adding unnecessary complexity to the structure. The same component that solves the optical problem also contributes to waterproofing and structural integrity, thereby minimizing the increase in overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution maintains consistent light color and meets standards by ensuring uniform light emission, enhances waterproof reliability, and extends the service life of the lamp.
Implementation Method 1
a refractive index of the potting glue is inconsistent with a refractive index of air, a propagation path of light on the contact surface is changed, and light of a part of angle cannot enter the interior of the fluorescent glue body for secondary excitation through a total reflection phenomenon
Data Source
AI summary
The present invention discloses an LED packaging structure and a process, including a support, a chip, positive and negative electrodes, a wire, a fluorescent glue, and a quartz plate with a flat surface, where the support is provided with a bowl cup, the chip is arranged in the bowl cup, the positive and negative electrodes are arranged at the bottom of the bowl cup, the wire correspondingly connects a positive electrode and a negative electrode of the chip to the positive and negative electrodes, the fluorescent glue is potted in the bowl cup to cover the chip and the wire, the quartz plate is connected to the top of the support to seal the bowl cup, and an air separation layer is formed between the quartz plate and a surface of the fluorescent glue.