Light Emitting Package Radial Reflection Heat Dissipation

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional light emitting element packages face challenges with heat dissipation, leading to potential inflation of molded materials and reduced lifespan due to inadequate heat discharge.

Innovation Solution

A light emitting element package design incorporating a lead frame, molded material with an opening, and a reflection structure with a supporting and radial portion, along with an adhesive layer, to enhance heat radiation and luminance, where the reflection structure is strategically positioned to direct heat away from the light emitting element.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a conventional light emitting element package is used, then the structure is simple, but heat dissipation is insufficient causing molded material inflation and reduced lifespan

Engineering Contradiction:
Improveheat dissipationVSAvoidlifespan
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The reflection structure is divided into multiple radial portions extending from the light emitting element outward, creating segmented heat dissipation pathways. Each radial portion acts as an independent heat conduction channel, collectively forming a comprehensive thermal management system that effectively distributes and dissipates heat across multiple directions.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The reflection structure extends radially in multiple dimensions from the light emitting element, transforming the heat dissipation approach from a single-direction or planar configuration to a three-dimensional radial network. This dimensional expansion increases the heat dissipation surface area and improves thermal coupling with the molded material.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Temperature

If a conventional light emitting element package is used, then the manufacturing process is simple, but heat generated by the light emitting element cannot be easily discharged

Engineering Contradiction:
Improveheat dischargeVSAvoidmanufacturing complexity
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The reflection structure integrates multiple functions into a single component: it serves as both a light reflection element to improve luminance and a heat dissipation structure through its radial geometry. This merging of optical and thermal management functions into one structure simplifies the overall package design while achieving both goals simultaneously.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The radial reflection structure performs multiple roles: reflecting light forward to enhance luminance, conducting heat away from the light emitting element, and potentially serving as a mechanical support structure. This multi-functionality reduces the need for separate heat sink components and simplifies the overall package architecture.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Temperature

If the reflection structure is added to improve heat radiation, then heat dissipation is enhanced, but the device complexity increases

Engineering Contradiction:
Improveheat radiation performanceVSAvoidpackage structure
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The reflection structure integrates multiple functions into a single component: it serves as both a light reflection element to improve luminance and a heat dissipation structure through its radial geometry. This merging of optical and thermal management functions into one structure simplifies the overall package design while achieving both goals simultaneously.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively improves heat radiation and luminance by allowing efficient heat dissipation and maintaining high luminance in the forward direction, thereby extending the lifespan of the light emitting element package.

Implementation Method 1

a light emitting element on the lead frame

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Implementation Method 2

a reflection structure having an opening that corresponds to the opening of the molded material, and contacting the molded material... strategically positioned to direct heat away from the light emitting element

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUSRE48474E1Light emitting device package and backlight unit comprising the same
Publication Date: 2021.03.16 LUMENS CO LTD
  • USRE48474E1 patent drawing
  • USRE48474E1 patent drawing
  • USRE48474E1 patent drawing

AI summary

Disclosed is a light emitting element package having excellent heat radiation performance and high luminance, and a backlight unit including the same. The light emitting element package includes a package including a lead frame, a light emitting element provided on the lead frame, and a molded material combined with the lead frame and having an opening for emitting light generated by the light emitting element, and a reflection structure having an opening corresponding to the opening of the molded material, and contacting the molded material.