Light Emitting Device Package with Recessed Adhesive Bonding
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Solution Overview
Problem
Current semiconductor device packages face challenges in improving light extraction efficiency, electrical characteristics, and manufacturing cost, while also experiencing issues with bonding strength and re-melting phenomena during re-bonding or heat-treating processes.
Innovation Solution
A light emitting device package design featuring a package body with first and second openings and a recess, where the light emitting device has bonding parts on these openings, and an adhesive is provided at the recess to enhance bonding and prevent re-melting, using materials like Ti, Al, In, Ir, Ta, Pd, Co, Cr, Mg, Zn, Ni, Si, Ge, Ag, Ag alloy, Au, Hf, Pt, Ru, Rh, Sn, Cu, ZnO, IrOx, RuOx, NiO, RuOx/ITO, or their alloys for bonding parts and Ag, Au, Pt, Sn, Cu, or SAC alloys for conductive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional bonding methods are used for semiconductor device packages, then manufacturing process is simple, but bonding strength is insufficient and re-melting occurs during re-bonding or heat-treating
Solution Approach 1:
The bonding structure is divided into multiple functional parts: a base bonding layer and an additional reinforcement bonding layer with specific material compositions. This segmentation allows each layer to perform its specialized function - the base layer provides initial bonding while the reinforcement layer prevents re-melting and enhances strength, resolving the contradiction between bonding strength and structural simplicity.
Solution Approach 2:
The patent employs composite material structures where different metal layers (such as Cu/W, Cu/Mo, Cu/Al, or Cu/Ni combinations) are stacked together. These composite bonding structures combine materials with complementary properties - copper provides ductility and bonding capability while tungsten, molybdenum, aluminum, or nickel provide high melting points and structural stability, preventing re-melting during heat treatment while maintaining manufacturing feasibility.
2Illumination intensity
If light extraction efficiency is improved through package design, then optical performance increases, but manufacturing cost increases
Solution Approach 1:
The package structure implements local quality optimization by positioning specific material layers and structural features at precise locations where they are most effective for light extraction. For example, reflective layers are placed at specific angles and positions to redirect light, while bonding layers are localized to critical bonding parts. This targeted approach improves light extraction efficiency without requiring expensive comprehensive structural changes throughout the entire package.
Solution Approach 2:
The patent utilizes parameter changes in material properties and structural dimensions to optimize light extraction. By adjusting the thickness, composition, and optical properties of bonding layers and package materials, the design achieves improved light extraction efficiency through controlled modifications to refractive indices, reflectivity, and layer thicknesses rather than through expensive structural redesigns.
3Temperature
If bonding layers with high melting point materials are used to prevent re-melting, then thermal stability improves, but manufacturing complexity increases
Solution Approach 1:
The patent merges the bonding function and thermal resistance function into a single integrated bonding layer structure. The bonding layer simultaneously provides adhesion between components and thermal stability through its material composition (Cu/W, Cu/Mo, Cu/Al, or Cu/Ni). This merging eliminates the need for separate thermal barrier layers, reducing overall structural complexity while achieving both bonding and thermal stability objectives.
Solution Approach 2:
The bonding layers are designed with multi-functionality, serving multiple purposes: electrical conduction, mechanical bonding, and thermal stability. By selecting materials like tungsten, molybdenum, aluminum, or nickel in combination with copper, the bonding layers universally perform multiple functions simultaneously, reducing the need for additional specialized components and simplifying the overall package structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves light extraction efficiency, electrical characteristics, and manufacturing yield, while preventing re-melting and reducing manufacturing costs by using a novel package structure and materials that enhance bonding strength and thermal stability.
Implementation Method 1
an adhesive is provided at the recess to enhance bonding and prevent re-melting
Implementation Method 2
a light emitting device that generates light distributed in a wavelength range of 200 nm to 400 nm
Implementation Method 3
improving the light extraction efficiency of a semiconductor device
Data Source
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AI summary
A light emitting device package according to an embodiment includes: a package body; a light emitting device disposed on the package body; and an adhesive disposed between the package body and the light emitting device. The package body includes first and second openings passing through the package body on an upper surface of the package body and a recess provided to concave in a direction of a lower surface of the package body from the upper surface of the package body. The light emitting device includes a first bonding part disposed on the first opening and a second bonding part disposed on the second opening. The adhesive is provided at the recess.