LED Package Recess Design for Thermal and Optical Management
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Solution Overview
Problem
Existing light emitting diode (LED) packages face issues with thermal emission efficiency due to limited heat dissipation paths and light losses caused by low optical reflectance substrates, along with misalignment challenges during chip positioning.
Innovation Solution
The LED package design features an LED chip positioned in a recess on the package body with expanded heat dissipation through lateral surfaces and reduced light losses by using materials with improved optical reflectance, combined with self-alignment techniques for precise chip placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the LED chip is positioned on the package body with limited heat dissipation paths, then the device complexity is reduced, but the thermal emission efficiency deteriorates
Solution Approach 1:
The patent transitions from conventional planar heat dissipation to three-dimensional heat dissipation by positioning the LED chip in a recess and utilizing lateral surfaces of the package body for heat dissipation. This dimensional expansion allows heat to escape through multiple pathways (bottom surface and lateral surfaces), significantly improving thermal emission efficiency without complicating the overall device structure
Solution Approach 2:
The package body is designed with different thermal conductivity properties in different regions. The recess structure and lateral surfaces are specifically engineered to optimize local heat dissipation characteristics, creating high-performance thermal pathways where needed while maintaining structural simplicity elsewhere
2Ease of manufacture
If a substrate with low optical reflectance is used, then the manufacturing cost is reduced, but light losses increase
Solution Approach 1:
Instead of requiring the entire substrate to have high optical reflectance, the patent applies reflective properties locally at the recess bottom surface where light reflection is most critical. This localized approach maintains manufacturing cost-effectiveness while minimizing light losses at the key interface
Solution Approach 2:
The patent converts potentially harmful light absorption by the substrate into beneficial light management by strategically positioning and shaping the recess structure. The geometry of the recess is designed to guide and redirect light, turning what would be loss pathways into productive optical pathways
3Ease of manufacture
If conventional chip positioning methods are used, then the ease of manufacture is maintained, but misalignment occurs during chip positioning
Solution Approach 1:
The recess structure is designed to enable self-alignment of the LED chip during the mounting process. The geometric features of the recess automatically guide the chip into the correct position, eliminating the need for complex external alignment mechanisms or procedures while maintaining high manufacturing precision
Solution Approach 2:
The recess is pre-formed in the package body with precise dimensions and positioning before chip mounting. This preliminary structuring creates built-in alignment features that guide the chip into the correct position, ensuring manufacturing precision is achieved through the design itself rather than through complex positioning procedures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal emission efficiency and reduces light losses while improving alignment accuracy, resulting in improved performance for LED packages and lighting systems.
Implementation Method 1
A light emitting diode package in accordance with claim 1 is provided
Implementation Method 2
a main path through which heat generated from the LED chip is transmitted may be limited to the bottom surface of the LED chip
Data Source
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AI summary
Provided are a light emitting device (LED) package and a lighting system including the same. The LED package comprises a package body comprising a recess in an upper portion thereof, and an LED chip provided in the recess of the package body.