Light Emitting Device Package with Recessed Resin for Extraction
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Solution Overview
Problem
Current light emitting device packages face challenges in improving light extraction efficiency, electrical characteristics, and manufacturing costs, while also experiencing issues with bonding force and re-melting phenomena during re-bonding or heat treatment.
Innovation Solution
The proposed solution involves a light emitting device package design with a body having specific openings and recesses, a conductive layer, and resins with reflective and scattering materials, including K2SiF6:Mn4+ phosphor, to enhance light extraction and electrical characteristics, and prevent re-melting by optimizing the package structure and materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional light emitting device packages are used, then manufacturing is simpler, but light extraction efficiency is insufficient
Solution Approach 1:
The package body is divided into multiple recesses (first recess, second recess, third recess) that segment the internal space to control light paths. This segmentation allows light to be extracted through multiple directions and interfaces, improving overall light extraction efficiency while maintaining a manageable manufacturing process
Solution Approach 2:
Different regions of the package are assigned different functions: the first recess contains scattering material for diffuse light extraction, the second recess contains wavelength conversion material for color transformation, and the third recess provides structural support. This local differentiation optimizes light extraction at each specific location
2Strength
If bonding strength is increased through stronger bonding, then bonding force improves, but re-melting phenomena occur during re-bonding or heat treatment
Solution Approach 1:
A resin layer is introduced as an intermediary material between the light emitting device and the package body. This resin layer acts as a buffer that distributes thermal stress and prevents direct heat transfer during re-bonding or heat treatment, thereby preventing re-melting of the bonding interface while maintaining adequate bonding strength
Solution Approach 2:
The resin layer changes its physical parameters (viscosity, thermal conductivity) with temperature to provide different functions at different stages: at bonding temperature, it provides adequate adhesion, while at re-bonding or heat treatment temperatures, it prevents re-melting by controlling heat transfer and maintaining structural integrity
3Ease of manufacture
If package structure is simplified to reduce manufacturing cost, then manufacturing cost decreases, but light extraction efficiency and electrical characteristics deteriorate
Solution Approach 1:
The resin layer serves multiple functions simultaneously: it provides electrical insulation, mechanical bonding, thermal management, and light scattering. This multi-functionality allows the package structure to be relatively simple while still achieving high light extraction efficiency and good electrical characteristics, thereby reducing manufacturing cost
4Ease of manufacture
If conventional materials are used, then material selection is easier, but discoloration and re-melting phenomena occur
Solution Approach 1:
The package uses composite materials combining the resin layer with scattering material and wavelength conversion material. This composite structure provides enhanced resistance to discoloration and re-melting while maintaining ease of manufacture through standardized material selection and processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves light extraction efficiency, electrical characteristics, and manufacturing yield, while preventing re-melting and discoloration, thus enhancing the reliability and cost-effectiveness of the light emitting device package.
Implementation Method 1
including K2SiF6:Mn4+ phosphor
Implementation Method 2
a conductive layer disposed in the first and second openings, respectively
Implementation Method 3
resins with reflective and scattering materials
Implementation Method 4
resins with reflective and scattering materials
Data Source
AI summary
A semiconductor device package includes a light emitting device disposed on a body, and at least one resin disposed between the body and the light emitting device. The body may include first and second opening parts passing through the body from the upper surface of the body, and at least one recess concavely provided from the upper surface of the body towards the lower surface of the body. The light emitting device may include a first bonding part disposed on the first opening part, and a second bonding part disposed on the second opening part. The at least one recess may be disposed between the first and second opening parts, and along the circumferences of the first and second opening parts. The at least one resin may be provided to the at least one recess. The at least one resin may include a reflective material.