LED Package Reflecting Cup with Heat-Resistant Layer
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Solution Overview
Problem
Conventional LED packages face challenges in efficiently directing light emission and heat management, leading to reduced luminous efficiency and potential yellowing due to inadequate reflection and heat resistance.
Innovation Solution
The LED package incorporates a reflecting cup and a heat-resistant reflecting layer between the cup and the LED die, allowing for improved light emission from lateral sides and effective heat dissipation, while a phosphor layer enhances light mixing and protection from yellowing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional LED package structure is used, then the structure is simple, but the luminous efficiency is reduced due to inadequate light reflection and emission from lateral sides
Solution Approach 1:
The reflective cup is divided into multiple reflective surfaces including a first reflective surface on the lateral side and a second reflective surface on the bottom side, each oriented to reflect light in different directions. This segmentation of reflective functions increases luminous efficiency by capturing and redirecting light that would otherwise be lost, while maintaining a relatively simple integrated cup structure.
Solution Approach 2:
The invention utilizes three-dimensional reflective surfaces oriented at different angles and positions within the package. The lateral reflective surface redirects light horizontally, while the bottom reflective surface redirects light downward, creating multi-directional light emission that significantly improves luminous efficiency compared to conventional two-dimensional packaging approaches.
2Productivity
If a reflecting cup is added to improve light reflection, then luminous efficiency improves, but heat management becomes inadequate leading to yellowing
Solution Approach 1:
A heat-resistant reflecting layer is introduced as an intermediary material between the LED die and the reflective cup. This layer serves dual functions: it maintains the reflective properties needed for high luminous efficiency while simultaneously providing thermal resistance to prevent heat-induced yellowing of the package components.
Solution Approach 2:
The reflective cup structure combines multiple materials with complementary properties - a reflective base material for light redirection and a heat-resistant material layer for thermal protection. This composite construction allows the package to achieve both high luminous efficiency through effective light reflection and reliability through resistance to thermal degradation and yellowing.
3Productivity
If light emission from lateral sides is enabled, then luminous efficiency increases, but heat dissipation becomes more challenging
Solution Approach 1:
The reflective cup structure incorporates localized reflective surfaces positioned and oriented to optimize light emission from specific directions. The lateral reflective surface is specifically designed to redirect light horizontally, while the bottom reflective surface handles downward light redirection. This localized optimization of reflective properties in different areas allows improved luminous efficiency while the heat-resistant layer manages thermal concerns in critical zones.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances luminous efficiency by allowing light emission from lateral sides and ensures heat resistance, preventing yellowing and size reduction of the LED package.
Implementation Method 1
a reflecting layer 50 formed between the LED die 20 and the reflecting cup 30
Implementation Method 2
a phosphor layer 40 covering and sealing the LED die 20
Implementation Method 3
a reflecting cup 30 formed on the electrodes 10 and surrounding the LED die 20
Data Source
AI summary
The present disclosure provides a light emitting diode package which includes a plurality of electrodes, an LED die, a reflecting cup, a reflecting layer, and a phosphor layer. The LED die are electrically connected with the electrodes. The reflecting cup is formed on the electrodes and surrounds the LED die. The reflecting cup includes an inner surface. The reflecting layer is formed between the inner surface and LED die, and the reflecting layer has a higher pyrogenation temperature than the reflecting cup. The phosphor layer covers the LED die.