LED Package Structure with Reflective Component for Central Illumination
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Solution Overview
Problem
Existing LED package structures face issues with metal wire breakage and inadequate central illumination, particularly in ultra-high-power outdoor applications, where they struggle to replace high-intensity discharge lamps effectively.
Innovation Solution
An LED package structure featuring a substrate with distinct regions for the LED chip and wire bonding, a reflective component that covers the metal wire and adjusts the light emitting angle, and optional transmissive and phosphor layers to enhance light efficiency and prevent leakage, along with a manufacturing method that includes molding and plasma treatment to ensure robust assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If chip-installing and wire bonding is used in LED package structure, then electrical connection is achieved, but metal wire breakage occurs frequently
Solution Approach 1:
The patent extracts the metal wire bonding process from the package structure and replaces it with direct electrode pad connections on the substrate. This eliminates the metal wire component that is prone to breakage, thereby resolving the reliability issue while maintaining electrical connectivity.
Solution Approach 2:
The substrate serves as an intermediary component with integrated electrode pads that directly connect to the LED chip electrodes. This mediator eliminates the need for metal wire bonds, providing a more reliable electrical connection path.
2Illumination intensity
If conventional LED package structure is used, then basic lighting function is achieved, but central illumination is insufficient
Solution Approach 1:
The patent introduces a lens component above the LED chip to control light distribution in the vertical dimension. This lens focuses light rays toward the central axis, significantly enhancing central illumination without complicating the horizontal package structure.
Solution Approach 2:
The lens is positioned specifically above the light emitting region to concentrate light output in the central area. This localized light control improves central illumination precisely where needed without affecting other regions of the package.
3Illumination intensity
If wide viewing angle is maintained in LED package, then light distribution is broad, but central illuminance is reduced
Solution Approach 1:
The lens modifies light rays in the vertical dimension by refocusing them toward the central axis, creating a concentrated beam pattern. This dimensional control of light paths enables high central illuminance while maintaining adequate viewing angle through proper lens design.
Solution Approach 2:
The lens changes the angular distribution parameter of emitted light by refracting rays. This parameter modification concentrates light energy in the central region while preserving sufficient viewing angle for practical applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents metal wire breakage, narrows the viewing angle, and significantly improves central illuminance, making it suitable for high-power outdoor applications and potentially replacing traditional HID lamps.
Implementation Method 1
The reflective component includes a first portion surrounding the LED chip and a second portion correspondingly disposed on the second region
Implementation Method 2
A light emitting diode (LED) is a light emitting component using a semiconductor as a light emitting material
Data Source
AI summary
A light emitting diode (LED) package structure is provided and includes a substrate, an LED chip and a reflective component. The substrate has a first and a second region, and the substrate includes at least one electrode pad disposed on the second region. The LED chip is disposed on the substrate and has a chip upper surface with a light emitting region and a wire bonding region. The LED chip includes at least one electrode contact located at the wire bonding region and is electrically connected to the at least one electrode pad via a metal wire. The reflective component includes a first portion and a second portion. The first portion includes a first surface flush with the light emitting region and the second portion includes a second surface above a highest point of the metal wire.