LED Package Structure with Reflective Groove for Light Efficiency
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Solution Overview
Problem
The light output efficiency of packaged LEDs is limited by the difference in refractive indices between the LED chip and air, leading to low light usage efficiency.
Innovation Solution
A LED package structure with a high reflection substrate is developed, featuring a reflective layer on the outer surface of an annular protruding portion and a trapezoidal shaped receiving groove, along with a wiring pattern and insulating layer, to enhance light reflection and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a conventional LED package structure is used, then the LED chip can be bonded on the substrate, but the light output efficiency is limited by the refractive index difference between the LED chip and air
Solution Approach 1:
The patent converts the harmful light loss caused by refractive index mismatch into a beneficial reflection mechanism. By introducing a reflective layer on the substrate and forming a receiving groove with specific angular surfaces, the patent redirects light that would otherwise be lost due to refraction into useful output directions, thereby improving light output efficiency and reducing energy waste.
Solution Approach 2:
The patent applies local quality by creating a specific receiving groove structure with angular side surfaces at predetermined angles (45-60 degrees) and applying reflective material selectively to the substrate and groove surfaces. This localized structural modification optimizes light reflection in specific directions while maintaining the overall LED package structure, thereby improving light usage efficiency without requiring complete structural redesign.
2Use of energy by moving object
If a reflective layer is added to improve light reflection, then light efficiency increases, but device complexity and manufacturing complexity increase
Solution Approach 1:
The patent merges the reflective layer function with the substrate structure by integrating the reflective coating directly onto the substrate and the side surfaces of the receiving groove. This combination eliminates the need for separate reflective components and simplifies the overall package structure while maintaining high light reflection efficiency, thereby reducing device complexity.
Solution Approach 2:
The patent utilizes the vertical dimension by forming a receiving groove with angular side surfaces that extend downward from the LED chip bonding surface. This three-dimensional structural approach allows light reflection to occur at multiple surfaces (substrate bottom and groove sides) simultaneously, improving light efficiency without requiring additional planar components that would increase device complexity.
3Use of energy by moving object
If a receiving groove with angular surfaces is formed, then light reflection efficiency improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent specifies a range for the groove side surface angles (45-60 degrees) rather than requiring a single precise angle. This parameter range approach allows manufacturing flexibility while still achieving effective light reflection, thereby reducing manufacturing precision requirements. The reflective layer application is also specified to cover the substrate and groove surfaces within practical manufacturing tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly increases light reflection efficiency and overall light efficacy of the LED package by effectively utilizing the reflective layer and heat dissipation channels, while reducing material and production costs.
Implementation Method 1
A LED package structure with a high reflection substrate is needed for increasing the light efficiency of LEDs
Data Source
AI summary
The present disclosure relates to a method for manufacturing a LED package structure. First, a support plate including a top surface is provided. An annular groove is defined on the top surface and a protruding portion on the support plate is surrounded by the annular groove. Second, a reflecting layer is formed on surfaces and periphery portions of the annular groove. Then, a wiring pattern is formed on the top surface corresponding to the protruding portion. An insulting layer is formed in spaces of the wiring pattern and the annular groove. The support plate is removed and a receiving groove is formed by the insulting layer and the corresponding protruding portion. Finally, a LED chip is received in the receiving groove and bonded on the wiring pattern to obtain a LED package structure. A LED package structure made by the above method is also provided.