LED Package Reflective Housing Gap Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional LED package structures experience electrical errors due to the fluorescent body covering the circuit layer, leading to poor electrical connections between the LED chip and the circuit layer, and issues with light shape and brightness.
Innovation Solution
The light-emitting unit of the LED package structure is designed with a gap of 3 µm to 10 µm between the fluorescent body and the circuit layer, filled with a reflective housing or light transparent layer, ensuring the electrical connection is not influenced by the fluorescent body, and the top planes are aligned to optimize light efficiency and prevent yellow and blue rings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the fluorescent body covers the circuit layer, then the LED package structure is simplified, but electrical connection reliability deteriorates
Solution Approach 1:
The patent segments the package structure by introducing a reflective housing that creates a physical separation between the fluorescent body and the circuit layer. This segmentation prevents the fluorescent body from directly covering the circuit layer, thereby maintaining electrical connection reliability while preserving the simplified package structure concept.
Solution Approach 2:
The reflective housing acts as an intermediary element between the fluorescent body and the circuit layer. It fills the gap and prevents direct contact between these two components, ensuring that the fluorescent body does not interfere with the electrical connections while still allowing the package to maintain a compact design.
2Ease of manufacture
If the fluorescent body covers the die bonding area, then manufacturing is easier, but electrical connection quality deteriorates
Solution Approach 1:
The reflective housing segments the package into distinct functional zones, ensuring that the fluorescent body is positioned in a way that does not overlap with the die bonding area. This segmentation allows for easier manufacturing processes while maintaining high electrical connection quality by preventing fluorescent body interference with the bonding interface.
Solution Approach 2:
The reflective housing serves as a mediator that fills the gap between the fluorescent body and the circuit layer, preventing the fluorescent body from encroaching on the die bonding area during assembly. This ensures that electrical connection quality is maintained while allowing for straightforward manufacturing processes.
3Shape
If the reflective housing top plane is lower than the light-emitting unit, then light distribution is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent specifies a controlled height difference parameter between the reflective housing top plane and the light-emitting unit top plane (within 0-30 μm). By defining this parameter range, the patent optimizes light distribution while managing manufacturing precision requirements through clear specification of acceptable tolerances.
Solution Approach 2:
The reflective housing is designed with specific local geometric features, including the controlled height difference between its top plane and the light-emitting unit. This local quality optimization enhances light distribution in the critical emission area while the overall structure maintains manufacturability through well-defined dimensional specifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves electrical connections, enhances forward light efficiency, and ensures better light distribution and color uniformity, addressing issues of poor brightness and light shape.
Implementation Method 1
the gap is filled with the reflective housing (or the light transparent layer)... thus problems about light shape and poor brightness can be avoided
Data Source
Figure 1~2
Figure 3
Figure 4
AI summary
An LED package structure includes a substrate (1), a circuit layer (2) and an insulating layer (4) both disposed on the substrate (1), a light-emitting unit (5), and a reflective housing (7) integrally formed with the insulating layer (4). The light-emitting unit (5) includes an LED chip (51) and a fluorescent body (52) encapsulating the LED chip (51). The light-emitting unit (5) is mounted on the insulating layer (4) and the circuit layer (2). The fluorescent body (52) of the light emitting unit is spaced apart from the circuit layer (2) with a gap (G) in a range of 3∼10µm. The reflective housing (7) is formed on the insulating layer (4) and the circuit layer (2) and is further filled within the gap (G). A top plane (71) of the reflective housing (7) arranged away from the substrate (1) is lower than or equal to that of the light-emitting unit (5), and a distance (D4) between the two top planes (71, 521) is in a range of 0∼30µm.