Light Emitting Device Package Reflective Layer Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In light emitting device packages with flip chip bonding, light is typically emitted in a downward direction, leading to degraded light output efficiency due to inefficient light reflection and transmission.
Innovation Solution
A light emitting device package design incorporating a substrate, a light emitting structure with conductive semiconductor layers, a reflective layer positioned under the insulating layer and electrodes, and a distributed Bragg reflector to enhance light reflection and output efficiency, including a reflective layer extending under the electrodes and contact holes to redirect downward light.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If light emitting structure emits light in downward direction, then device structure is simplified, but light output efficiency is degraded
Solution Approach 1:
The patent converts the harmful downward-directed light that would otherwise be wasted into useful output by implementing a reflective layer beneath the light emitting structure. This reflective layer captures the downward light and redirects it upward, transforming the structural simplicity advantage into a dual-benefit solution that maintains ease of manufacture while recovering energy that would have been lost.
Solution Approach 2:
The patent addresses the light direction issue by adding a vertical dimension solution - placing a reflective layer in the downward direction beneath the light emitting structure. This allows the device to maintain its simplified downward emission structure while adding a reflective dimension that redirects light upward, effectively utilizing both directional emissions without increasing horizontal complexity.
2Loss of energy
If reflective layer is added to improve light output efficiency, then light output efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges the reflective layer with the existing substrate or packaging structure, integrating the light reflection function into the already-present structural elements. This consolidation approach improves light output efficiency by adding reflection capability without proportionally increasing device complexity, as the reflective function is combined with existing structural components rather than adding entirely separate elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly improves light output efficiency by effectively reflecting and redirecting light emitted in the downward direction, enhancing the overall performance of the light emitting device package.
Implementation Method 1
a first insulating layer configured to extend from under the light emitting structure to a space between a side of the light emitting structure and the first electrode and configured to reflect light; and a reflective layer disposed under the first insulating layer
Implementation Method 2
The first insulating layer may include a distributed Bragg reflector
Data Source
AI summary
Disclosed are a light emitting device package and a lighting apparatus. The light emitting device package includes a substrate, a light emitting structure disposed under the substrate and including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, a first electrode connected to the first conductive type semiconductor layer exposed through at least one contact hole, a second electrode connected to the second conductive type semiconductor layer, a first insulating layer configured to extend from under the light emitting structure to a space between a side of the light emitting structure and the first electrode and configured to reflect light, and a reflective layer disposed under the first insulating layer.