Light Emitting Device Package Reflective Resin Layer Design
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Solution Overview
Problem
Existing light emitting device packages face challenges in uniformly arranging reflective layers, leading to limited luminance improvement and re-melting issues during re-bonding processes, which affect electrical characteristics and manufacturing efficiency.
Innovation Solution
A light emitting device package design with a package body featuring a reflective resin layer and a transparent resin layer, where the reflective resin layer is uniformly spaced around the light emitting device to enhance light extraction efficiency and prevent re-melting by using materials like TiO2 and SiO2, and a structure with inclined surfaces to improve reflectance and prevent discoloration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a reflective layer is arranged in a cavity of a light emitting device package, then luminance is improved, but uniform arrangement is difficult to achieve
Solution Approach 1:
The patent applies local quality by making the reflective layer's reflectivity position-dependent. The reflectivity increases as the distance from the light emitting element decreases, with the reflective layer comprising multiple layers (first, second, third reflective layers) with progressively higher reflectivity. This gradient structure ensures uniform light extraction efficiency across different regions of the package while maintaining improved luminance.
2Strength
If re-bonding process is performed to improve electrical characteristics, then bonding strength is improved, but re-melting phenomenon occurs
Solution Approach 1:
The patent applies preliminary action by forming a protective layer on the bonding pad before the re-bonding process. This protective layer prevents oxidation and contamination of the bonding pad surface, ensuring that when re-bonding occurs, the electrical characteristics are maintained or improved without causing re-melting phenomena. The protective layer is removed only after the bonding process is complete.
3Productivity
If phosphor layer is disposed adjacent to light emitting device, then light conversion is efficient, but phosphor layer deteriorates
Solution Approach 1:
The patent applies the extraction principle by separating the phosphor layer from the light emitting device. Instead of disposing the phosphor layer adjacent to the light emitting device, the patent positions the phosphor layer at a distance, allowing efficient light conversion while preventing deterioration from direct exposure to heat and electromagnetic radiation from the light emitting device.
4Stability of the object's composition
If transparent resin layer is used to prevent discoloration, then appearance quality is improved, but light extraction efficiency may be reduced
Solution Approach 1:
The patent applies composite materials by combining the transparent resin layer with a reflective layer having position-dependent reflectivity. The transparent resin layer prevents discoloration and maintains appearance quality, while the underlying reflective layer with varying reflectivity compensates for any light extraction reduction, ensuring overall luminance is improved or maintained.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly enhances luminance, electrical characteristics, and manufacturing yield while preventing re-melting and discoloration, thereby improving the reliability and cost-effectiveness of the semiconductor device package.
Implementation Method 1
a package body (110) and a light emitting device (120). The package body (110) includes a first frame (111) and a second frame (112)... a reflective resin layer (170) disposed on the side surface of the cavity (C)... to enhance light extraction efficiency
Implementation Method 2
a transparent resin layer (160) disposed on the side surface of the light emitting device (120)
Implementation Method 3
the first frame (111) and the second frame (112) each have an inclined surface... to improve reflectance
Data Source
Figure 1~2
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Figure 5~6
AI summary
The embodiment relates to a semiconductor device package, a method of manufacturing the semiconductor device package, and a light source apparatus. According to another embodiment, there is provided a light emitting device package which includes a package body (110) including a frame (111, 112) and a body (113); a light emitting device (120) including first and second bonding parts (121, 122) and disposed on the body (113); a reflective resin layer disposed between the light emitting device and a side surface of a cavity (C) formed in the body; a transparent resin layer on the light emitting device; and a phosphor layer disposed on the transparent resin layer while being spaced apart from the light emitting device.