LED Package Reflective Layer Structure for Wide-Angle Brightness
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Solution Overview
Problem
Existing light-emitting diode (LED) package structures face challenges in improving brightness, volume, and light emitting angle, particularly in chip scale packaging technologies.
Innovation Solution
A light emitting package structure comprising a light emitting unit, reflective layer, reflective element, and optical layer, with a light blocking layer, designed to enhance light collection, reduce interference, and achieve a desired light distribution pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If chip scale packaging technology is used for LED, then volume is reduced, but brightness and light emitting angle performance are insufficient
Solution Approach 1:
The patent segments the package structure into distinct functional layers: a reflective layer with reflective elements for light redirection, an optical layer for light modification, and a light blocking layer for light management. This segmentation allows each layer to independently optimize its function, achieving high brightness in a compact volume by systematically managing light paths rather than relying on a single monolithic structure
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement of light paths by positioning the reflective layer to redirect light from the LED chip into the optical layer, which then directs light through the sidewalls. This dimensional approach to light management enables enhanced brightness and viewing angle without increasing package volume, as the light is efficiently routed through available spatial dimensions within the compact structure
2Volume of moving object
If chip scale packaging technology is used for LED, then volume is reduced, but light emitting angle is limited
Solution Approach 1:
The package is segmented into functional layers where the optical layer specifically addresses light distribution. This layer is configured to emit light through the sidewalls of the package, creating a broader viewing angle. The segmentation allows the optical layer to be optimized independently for wide-angle light emission while the overall package maintains compact dimensions
Solution Approach 2:
The patent achieves expanded light emitting angle by utilizing the sidewall surfaces as additional light emission dimensions. Rather than relying solely on top surface emission, the structure redirects light through the vertical sidewalls, effectively adding dimensional pathways for light exit. This enables viewing from multiple angles simultaneously without increasing the horizontal package footprint
3Illumination intensity
If reflective layer and light blocking layer are added, then light reflection and diffusion are optimized, but device complexity increases
Solution Approach 1:
The patent merges multiple light management functions into an integrated layered structure. The reflective layer, optical layer, and light blocking layer are combined in a compact stack configuration where each layer performs its function while occupying minimal space. This merging approach achieves high luminous intensity through coordinated light reflection and diffusion, while the integrated design prevents excessive complexity by maintaining a systematic, space-efficient arrangement
Solution Approach 2:
The patent employs thin-film reflective layers and light blocking layers that provide substantial optical control with minimal thickness. These thin film structures deliver high light reflection and blocking performance without adding significant volume or structural complexity, as the optical functionality is achieved through material properties rather than bulky mechanical structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure achieves improved brightness, reduced volume, and increased light emitting angle, with a batwing type light distribution and high contrast ratio, enhancing the overall performance of LED packages.
Implementation Method 1
The reflective layer encloses the sidewall surfaces of the light emitting unit
Implementation Method 2
The optical layer comprises a phosphor layer, a light diffusion layer or a combination thereof
Implementation Method 3
The optical layer comprises a phosphor layer
Data Source
AI summary
A light emitting package structure includes a light emitting unit, a reflective layer, a reflective element and an optical layer. The light emitting unit has a top surface, a bottom surface and sidewall surfaces. The bottom surface and the top surface are opposing to each other. The sidewall surfaces are between the top surface and the bottom surface. The light emitting unit further has an electrode portion on the bottom surface. The reflective layer encloses the sidewall surfaces of the light emitting unit. The reflective element is disposed on the light emitting unit and the reflective layer. The optical layer includes a phosphor layer, a light diffusion layer or a combination thereof. The optical layer is disposed between the top surface of the light emitting unit and the reflective element.


