LED Package Resin Structure for Strong Bonding and Low Resistance
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Solution Overview
Problem
Existing light emitting apparatuses face challenges in achieving high bonding strength between the base member and the resin member while maintaining low electrical resistance, and they often have complex production processes that increase costs and reduce productivity.
Innovation Solution
A light emitting apparatus with an electrically insulating base member and conductive pattern portions, where the resin portion partially covers the conductive pattern portions and extends to the periphery of the base member, and a method involving the formation of elongated through holes in the conductive pattern portions to improve bonding and reduce electrical resistance, using a combination of high and low viscosity resins to ensure complete coverage and integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the resin portion completely covers the conductive pattern portions, then the bonding strength between base member and resin is improved, but the electrical resistance increases
Solution Approach 1:
The patent applies local quality by creating through holes only in specific regions of the conductive pattern portions where the resin makes contact. This localized modification allows the resin to bond strongly with the base member through the exposed surfaces in the through holes, while preserving the electrical conductivity of the main conductive pattern areas that remain covered by resin.
2Reliability
If elongated through holes are formed in the conductive pattern portions, then electrical resistance is reduced, but the production process complexity increases
Solution Approach 1:
The patent applies parameter changes by modifying the physical structure of the conductive pattern portions through the formation of elongated through holes. This structural parameter change creates exposed surfaces that enhance bonding while maintaining electrical conductivity, resolving the contradiction between bonding strength and electrical resistance without requiring complex multi-step processes.
3Reliability
If the resin portion partially covers the conductive pattern portions, then electrical resistance is reduced, but the bonding strength decreases
Solution Approach 1:
The patent applies dimensionality change by introducing through holes that create vertical exposure of the base member surface within the resin layer. This adds a third dimension (depth) to the bonding interface, allowing the resin to bond to the base member through the through holes while still covering the conductive patterns on the surface, thus maintaining both electrical resistance and bonding strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances bonding strength between the base member and the resin, prevents peeling, and simplifies the production process, resulting in a reliable and cost-effective light emitting apparatus with improved light distribution and efficiency.
Implementation Method 1
the side surface of a light emitting device is covered with light reflective resin
Data Source
AI summary
A light emitting apparatus includes: an electrically insulating base member having, in a top plan view, a first edge, a second edge opposite the first edge, a third edge, and a fourth edge opposite the third edge, wherein the first and second edges of the base member extend in a first direction, and the third and fourth edges of the base member extend in a second direction; first and second electrically conductive pattern portions formed on an upper surface of the base member; at least one light emitting device that is electrically connected to the first and second electrically conductive pattern portions; a transparent member disposed on the at least one light emitting device; and a resin portion that surrounds the transparent member in the top plan view, and that partially covers the first and second electrically conductive pattern portions.