Light Emitting Device Package with Segmented Body and Resin
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Solution Overview
Problem
Current semiconductor device packages face challenges in improving light extraction efficiency, electrical characteristics, and manufacturing efficiency, while also experiencing issues with re-melting phenomena during re-bonding processes and high manufacturing costs.
Innovation Solution
The semiconductor device package design incorporates a light emitting device package with a first and second package body, bonding parts, and resins, featuring a unique structure with openings and conductive layers to enhance light extraction and electrical connections, and uses different materials for the package bodies and resins to improve bonding strength and prevent re-melting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional packaging structures are used, then manufacturing process is simple, but light extraction efficiency is insufficient
Solution Approach 1:
The package body is divided into multiple sections with different functions: a first package body portion for electrical connection and a second package body portion for light extraction. This segmentation allows each portion to be optimized independently - the first portion maintains simple manufacturing while the second portion incorporates light-extracting structures like transparent materials and reflective surfaces to improve light extraction efficiency.
Solution Approach 2:
The patent employs composite material structures combining transparent materials (for light extraction), reflective materials (for light redirection), and conductive materials (for electrical connection). This composite approach enables simultaneous achievement of high light extraction efficiency and manufacturing feasibility by selecting materials that balance performance requirements with processing capabilities.
2Reliability
If bonding strength is increased through stronger adhesives or higher bonding pressure, then bonding reliability improves, but re-melting phenomenon occurs during re-bonding
Solution Approach 1:
The patent modifies bonding parameters by selecting adhesives with appropriate glass transition temperatures and bonding temperatures that are below the reflow soldering temperature. This parameter optimization ensures strong bonding while preventing the adhesive from softening or melting during subsequent reflow processes, thereby eliminating the re-melting phenomenon.
Solution Approach 2:
The adhesive layer serves as an intermediary between the package body and the lead frame, providing a controlled bonding interface. By carefully selecting adhesive properties (viscosity, curing temperature, thermal stability), the system achieves reliable bonding without transmitting excessive thermal or mechanical stress that would cause re-melting during reflow soldering.
3Productivity
If manufacturing cost is reduced by simplifying structure or materials, then productivity improves, but light extraction efficiency and electrical characteristics deteriorate
Solution Approach 1:
The package body structure is designed to perform multiple functions simultaneously: providing mechanical support, enabling electrical connection through conductive portions, and facilitating light extraction through transparent and reflective portions. This multi-functionality reduces the need for additional separate components, thereby lowering manufacturing cost and complexity while maintaining high light extraction efficiency and electrical performance.
Data Source
AI summary
A light emitting device package according to an embodiment may comprise: a first package body including a first and a second opening; a light emitting device disposed on the first package body and including a first and a second bonding part; and a first resin disposed between the first package body and the light emitting device. The light emitting device may comprise one surface on which the first and second bonding parts are disposed, the first bonding part may comprise a first side surface and a lower surface facing the first package body, and the second bonding part may comprise a second side surface opposite to the first side surface, and a lower surface facing the first package body. The first resin may comprise an upper surface disposed on the one surface of the light emitting device, a third side surface extending from the upper surface to the lower surface of the first bonding part along the first side surface of the first bonding part, and a fourth side surface extending from the upper surface to the lower surface of the second bonding part along the second side surface of the second bonding part.