LED Package Sealing Structure to Prevent Resin Cracking
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Solution Overview
Problem
The existing semiconductor light-emitting apparatus faces challenges in improving light extraction efficiency and reliability due to the exfoliation and cracking of the sealing resin, which is exacerbated by the thickness difference between the sealing member and the package substrate.
Innovation Solution
A semiconductor light-emitting apparatus is designed with a frame body around the semiconductor light-emitting element, where the height of the frame body's upper surface is smaller than that of the semiconductor light-emitting element, allowing for a reduced height of the sealing member, thereby moderating its curvature and reducing the occurrence of exfoliation and cracks, while maintaining translucency at the emission wavelength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the sealing member is formed in a dome shape to improve light extraction efficiency, then light extraction efficiency is improved, but the sealing member is easily exfoliated or cracked due to increased thickness and distortion
Solution Approach 1:
The invention divides the sealing structure into two parts: a frame body with a first height and a sealing member with a second height. The sealing member is positioned on the frame body, creating a stepped configuration that segments the overall sealing structure. This segmentation allows the sealing member to have reduced thickness while maintaining the light extraction benefits of a dome shape, thereby preventing exfoliation and cracking.
Solution Approach 2:
The invention transitions from a conventional single-level dome-shaped sealing member to a two-level stepped structure by introducing the frame body. This dimensional change creates a hierarchical arrangement where the frame body provides structural support at the first height level, and the sealing member provides light extraction functionality at the second height level, resolving the contradiction between thickness and reliability.
2Illumination intensity
If the thickness of the sealing member is increased to form a dome shape, then light extraction efficiency is improved, but distortion caused by material difference increases leading to exfoliation or cracking
Solution Approach 1:
By segmenting the sealing structure into frame body and sealing member components with different heights, the invention reduces the thickness of the sealing member material while preserving the dome shape's light extraction benefits. This segmentation directly addresses the distortion issue by minimizing the material thickness that would otherwise cause warping during curing.
Solution Approach 2:
The invention changes the height parameter of the sealing member by positioning it on the frame body structure. This parameter modification allows the sealing member to maintain the optimal dome curvature for light extraction while having reduced thickness, thereby controlling distortion during the sealing process.
Data Source
AI summary
A semiconductor light-emitting apparatus includes: a package substrate; a semiconductor light-emitting element flip-chip bonded on the package substrate; a frame body provided around the semiconductor light-emitting element on the package substrate; and a sealing member that covers the semiconductor light-emitting element on the package substrate, covers an upper surface of the frame body, and has translucency at an emission wavelength of the semiconductor light-emitting element. A height of the upper surface of the frame body is smaller than a height ha of an upper surface of the semiconductor light-emitting element.