LED Package Reflective Resin Light Extraction
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Solution Overview
Problem
Current semiconductor light emitting devices face challenges in maximizing light extraction efficiency and structural stability due to issues with light absorption by conductive bumps and other package elements, as well as limitations in wavelength conversion and light distribution.
Innovation Solution
The semiconductor light emitting device incorporates a package body with a cavity and reflective resin portion, featuring a wavelength conversion film and light-transmitting bonding layer with inclined surfaces to guide light, and a wavelength conversion resin layer to enhance light extraction, while using conductive bumps and a reflective resin to prevent absorption and improve light directionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional LED package structure is used, then the device is simple to manufacture, but light extraction efficiency is reduced due to absorption by conductive bumps and package elements
Solution Approach 1:
The patent applies this principle by introducing a reflective resin portion that converts the harmful light absorption by conductive bumps and package elements into beneficial light reflection. The reflective resin is strategically positioned to reflect light that would otherwise be absorbed, directing it toward the wavelength conversion film and improving overall light extraction efficiency while maintaining the conventional package structure's manufacturing simplicity
Solution Approach 2:
The reflective resin portion acts as an intermediary element between the LED chip and the package cavity. It mediates the interaction between light and package elements by reflecting light away from conductive bumps and toward the wavelength conversion film, thereby reducing energy loss without requiring fundamental changes to the manufacturing process
2Device complexity
If light is directed straight up from the LED chip, then the structure is simple, but light distribution and extraction efficiency are limited
Solution Approach 1:
The patent applies this principle by introducing inclined surfaces to the wavelength conversion film and reflective resin portion. These inclined surfaces redirect light in multiple directions rather than allowing it to travel straight up, effectively adding angular dimensionality to light propagation. This improves light extraction efficiency by capturing and redirecting light that would otherwise be trapped or absorbed, without significantly complicating the overall device structure
3Device complexity
If a single wavelength conversion material is used, then the device structure is simple, but wavelength conversion effectiveness is limited
Solution Approach 1:
The patent applies this principle by using different wavelength conversion materials in different regions or layers. The first wavelength conversion material is positioned in direct contact with the LED chip, while the second wavelength conversion material is positioned in the reflective resin portion. This spatial differentiation of wavelength conversion materials allows for more effective and nuanced wavelength conversion across different light paths, improving overall energy utilization without requiring a completely complex multi-layer structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves light extraction efficiency by reducing absorption and enhancing light directionality, while maintaining structural stability and allowing for effective wavelength conversion, leading to improved performance in lighting applications.
Implementation Method 1
a wavelength conversion film on the second surface of the LED chip and including a first wavelength conversion material; a wavelength conversion resin layer on the wavelength conversion film... having a light-transmitting resin, the light-transmitting resin including a second wavelength conversion material
Implementation Method 2
a reflective resin portion in the cavity to cover the LED chip... a package body having a side wall having a first reflective surface, the first reflective surface being inclined
Data Source
AI summary
A semiconductor light emitting device includes: a package body having a cavity, and having a first wiring electrode and a second wiring electrode disposed on a bottom surface of the cavity; a light emitting diode (LED) chip having a first surface with a first electrode and a second electrode thereon, a second surface, and lateral surfaces, the LED chip being mounted in the cavity such that the first surface faces the bottom surface, a wavelength conversion film on the second surface of the LED chip, and including a first wavelength conversion material, and a reflective resin portion in the cavity that surrounds the LED chip.