LED Package Resin Filling via Pre-bent Leadframe
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Solution Overview
Problem
High-brightness LED packages face issues with incomplete resin filling and low adhesion due to increased cavity angles, leading to gaps, voids, and reduced brightness, as well as manufacturing defects like leakage and pattern recognition errors.
Innovation Solution
The design of LED packages with modified cavity structures and leadframe configurations that allow for improved resin filling and adhesion, including bent or etched electrical leads and zones on the leadframe to facilitate complete resin flow and secure retention, while maintaining or exceeding brightness levels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If cavity angle is increased to maintain brightness in thinner packages, then brightness specification is met, but resin filling becomes incomplete and adhesion decreases
Solution Approach 1:
The leadframe is pre-bent or pre-etched before molding to create gaps between the leadframe and cavity wall. This preliminary geometric modification ensures that resin can flow into areas that would otherwise be inaccessible due to the tight space formed by large cavity angles, preventing voids and incomplete filling while maintaining the required brightness performance.
Solution Approach 2:
The leadframe geometry is locally modified at specific locations where resin flow is restricted. By bending or etching the leadframe in targeted areas, the invention creates local gaps that allow resin penetration without changing the overall cavity angle or package thickness, thus maintaining brightness while improving resin filling completeness locally.
2Illumination intensity
If cavity angle is increased to maintain brightness in thinner packages, then brightness specification is met, but adhesion between components decreases
Solution Approach 1:
The leadframe is pre-bent or pre-etched before molding to create gaps between the leadframe and cavity wall. This preliminary geometric modification ensures that resin can flow into areas that would otherwise be inaccessible due to the tight space formed by large cavity angles, preventing voids and incomplete filling while maintaining the required brightness performance.
Solution Approach 2:
The leadframe geometry is locally modified at specific locations where resin flow is restricted. By bending or etching the leadframe in targeted areas, the invention creates local gaps that allow resin penetration without changing the overall cavity angle or package thickness, thus maintaining brightness while improving resin filling completeness locally.
3Length of moving object
If package thickness is reduced for thin display systems, then product compactness is improved, but resin filling becomes incomplete
Solution Approach 1:
The leadframe is pre-bent or pre-etched before molding to create gaps between the leadframe and cavity wall. This preliminary geometric modification ensures that resin can flow into areas that would otherwise be inaccessible due to the tight space formed by large cavity angles, preventing voids and incomplete filling while maintaining the required brightness performance.
Solution Approach 2:
Instead of changing the cavity angle or package thickness, the invention introduces a new dimensional feature by bending or etching the leadframe to create gaps in the third dimension. This allows resin flow paths to be opened without affecting the overall package thickness or cavity geometry, thus maintaining product compactness while improving resin filling.
Data Source
AI summary
High-brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion are provided. In one aspect, a high brightness package for a light emitter (e.g., a LED or LED chip) can include a body and a cavity disposed in the body. The cavity can include at least one cavity wall extending toward an intersection area of the body where the cavity wall intersects a cavity floor. The package can further include at least one electrical element having first and second surfaces, each of the first and second surfaces proximate the intersection area. The first surface can be disposed on a first plane and the second surface can be at least partially disposed on a second plane that is different than the first plane. The body can at least substantially cover the second surface.