Thin LED Package with Variable Thickness Resin Flange
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light emitting device packages face challenges in achieving a thin profile while maintaining stability and efficient heat dissipation, with conventional designs often resulting in thick packages and difficulties in producing thin-profile devices.
Innovation Solution
A package design featuring a bottomed recess with a first and second electrode, where the first resin fixes the electrodes and forms a flange portion with varying thickness, allowing for improved stability and heat dissipation, and a manufacturing method involving injection molding with a large inlet for high-viscosity resins to enhance light reflectivity and reduce package thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional package designs are used, then stability and heat dissipation are maintained, but package thickness increases
Solution Approach 1:
The resin is configured with varying thickness locally: a first thickness in the bottom portion for stability, and a second (smaller) thickness in the flange portion for profile reduction. This local differentiation allows the package to achieve thin overall thickness while maintaining structural stability through the thicker bottom section that properly supports the light emitting element.
2Illumination intensity
If high-viscosity resin is used for injection molding, then light reflectivity is improved, but manufacturing difficulty increases
Solution Approach 1:
A large inlet is provided in the mold to enable smooth injection of high-viscosity resin. The preliminary design of the inlet structure prevents manufacturing difficulties by allowing the viscous resin to flow properly into the mold cavity, thus enabling the use of high-light-reflectivity resin without compromising manufacturability.
3Length of moving object
If resin thickness is reduced for thin profile, then package thickness decreases, but mounting unsmoothness increases
Solution Approach 1:
The flange portion is designed with a specific thickness and extends beyond the light emitting element's light-emitting surface. This local structural design ensures that the reduced resin thickness does not compromise mounting smoothness, as the flange portion provides adequate support and creates a smooth mounting surface despite the overall thin profile of the package.
Data Source
AI summary
A package has a bottomed recess with a bottom portion. The package includes: a first electrode having a first outer lead portion and disposed in the bottom portion; a second electrode having a second outer lead portion and disposed in the bottom portion; and a first resin fixing the first electrode and the second electrode and constituting a part of the bottomed recess. The first resin has: a part between the first electrode and the second electrode disposed in the bottom portion; a wall portion constituting side walls of the bottomed recess; and a flange portion having a first part located adjacent to at least one of both sides of the first outer lead portion in plan view. The first part has a thickness different from a thickness of the first outer lead portion. A light emitting has: the package; and a light emitting element mounted on at least one of the first electrode and the second electrode of the package.