Light Emitting Device Package with Segmented Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor device packages face challenges in improving light extraction efficiency, electrical characteristics, and manufacturing cost, while also experiencing issues with re-melting phenomena during re-bonding and limited material selection due to high temperature exposure.
Innovation Solution
The semiconductor device package design features a structure with first and second frames, a body, light emitting device, conductive parts, and conductors, using materials like Ag, Au, and Cu, with a recess for resin to enhance light extraction and prevent re-melting, and allows for the use of less expensive resin materials by avoiding high temperature processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional semiconductor device packages use high temperature bonding processes, then bonding strength is improved, but re-melting phenomena occur during re-bonding and material selection is limited
Solution Approach 1:
The bonding structure is divided into multiple layers: a first bonding pad layer, a second bonding pad layer, and a bonding wire layer. This segmentation allows different materials and processes to be optimized for each layer, enabling low-temperature bonding that prevents re-melting while maintaining bonding strength.
Solution Approach 2:
The bonding process uses low temperature parameters instead of conventional high temperature processes. The first and second bonding pads are formed at temperatures below the melting point of the bonding wire material, preventing re-melting phenomena during subsequent re-bonding operations while achieving adequate bonding strength.
2Stability of the object's composition
If expensive resin materials are used to withstand high temperature processes, then thermal stability is improved, but manufacturing cost increases
Solution Approach 1:
The process temperature is reduced to below the melting point of the bonding wire, which eliminates the requirement for expensive high-temperature resistant resin materials. Conventional resin materials can be used in the package body without compromising thermal stability, significantly reducing manufacturing costs.
3Strength
If conventional bonding processes are used, then bonding strength is achieved, but re-melting phenomena occur during re-bonding
Solution Approach 1:
The bonding pads are designed with materials and structures that prevent re-melting before it can occur. The first bonding pad layer and second bonding pad layer are configured to maintain structural integrity at temperatures that would cause re-melting of conventional bonding materials, thereby preventing the harmful re-melting phenomenon during re-bonding operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves light extraction efficiency, electrical characteristics, and manufacturing yield, reduces costs, and prevents re-melting, while enabling the use of cost-effective resin materials for the package body.
Implementation Method 1
first and second conductive parts disposed under the first and second bonding parts, respectively, and extending into the first and second openings from the first and second bonding parts, respectively
Implementation Method 2
a light emitting device disposed on the body and comprising first and second bonding parts
Implementation Method 3
a light emitting device comprising compounds such as GaN and AlGaN has many merits such as wide and easily adjustable bandgap energy
Data Source
AI summary
A light emitting device package according to an embodiment may include first and second frames, a body, a light emitting device, first and second conductive parts, and first and second conductors. According to the embodiment, first and second frames may be spaced apart from each other and include first and second openings, respectively. The body may be disposed between the first and second frames. The light emitting device may be disposed on the body and include first and second bonding parts. The first and second conductive parts may be disposed under the first and second bonding parts. The first and second conductors may be disposed in the first and second openings, respectively. According to the embodiment, the first and second conductive parts may extend into the first and second openings from the first and second bonding parts, respectively, and the first and second conductors may be disposed between the first and second conductive parts and the first and second frames, respectively.