Light Emitting Device Package With Segmented Frames And Recesses
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor device packages face challenges in enhancing light extraction efficiency, electrical characteristics, and manufacturing cost reduction, while also experiencing issues with bonding strength and re-melting phenomena during the re-bonding process.
Innovation Solution
The semiconductor device package design includes multiple frames with through-holes and recesses, a conductive layer, and a resin for improved adhesive strength and electrical connectivity, allowing for series or parallel connection of light emitting devices to enhance light extraction and electrical performance, and a new package structure to reduce manufacturing costs and prevent re-melting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional semiconductor device packages are used, then manufacturing process is simple, but light extraction efficiency is low
Solution Approach 1:
The package structure is divided into multiple frames (first frame, second frame, third frame) with through-holes, creating a segmented architecture that improves light extraction pathways while maintaining manufacturability through modular assembly
Solution Approach 2:
The invention introduces vertical through-holes penetrating the frames, adding a vertical dimension to light extraction that complements the horizontal light emission path, thereby improving overall light extraction efficiency without complicating the horizontal manufacturing process
2Strength
If bonding strength is enhanced through stronger bonding materials, then adhesive strength improves, but re-melting phenomenon occurs during re-bonding
Solution Approach 1:
The bonding system uses a composite structure combining the resin material with the frame structure containing through-holes, creating a distributed bonding architecture that reduces stress concentration and prevents re-melting while maintaining adhesive strength
Solution Approach 2:
The resin is selectively positioned in specific regions between the frames and light emitting devices, creating localized bonding zones with optimized adhesive properties that prevent re-melting in critical areas while maintaining overall bonding strength
3Reliability
If multiple light emitting devices are connected in series or parallel, then electrical characteristics improve, but device complexity increases
Solution Approach 1:
The frames serve multiple functions simultaneously: they provide structural support, contain through-holes for light extraction, and establish electrical connections between multiple light emitting devices through their interconnected structure, thereby simplifying the overall connection architecture
Solution Approach 2:
The invention merges the structural support function with the electrical connection function by integrating the connection paths into the frame structure itself, reducing the number of separate components needed and simplifying the overall device complexity while maintaining improved electrical characteristics
4Ease of manufacture
If conventional package structures are used, then manufacturing cost is low, but manufacturing yield is reduced due to re-melting
Solution Approach 1:
The resin is pre-positioned in the package structure before final assembly, creating a protective layer that prevents re-melting during subsequent re-bonding processes, thereby improving manufacturing yield without significantly increasing manufacturing cost
Solution Approach 2:
The resin material acts as a cushioning layer between the frames and light emitting devices, providing thermal and mechanical protection that prevents re-melting phenomena during re-bonding operations, thereby improving manufacturing yield while maintaining cost-effectiveness
Data Source
AI summary
A light emitting device package is discussed. The light emitting device package includes a first frame having a first through hole; a second frame having a second through hole; a third frame having a third through hole; a fourth frame having a fourth through hole; a body including the first through fourth frames; a connecting frame diagonally extending in the light emitting device package from the second frame to the third frame; a first light emitting device including a first electrode pad and a second electrode pad, the first electrode pad being disposed on the first through hole of the first frame and the second electrode pad being disposed on the second through hole of the second frame; a second light emitting device including a third electrode pad and a fourth electrode pad, the third electrode pad being disposed on the third through hole of the third frame and the fourth electrode pad being disposed on the fourth through hole of the fourth frame; and a plurality of recesses on the body, and interposed between the first frame and the second frame, the plurality of recesses being spaced apart from each other.