Multi-Chip LED Package with Segmented Lead Design
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Solution Overview
Problem
Conventional light emitting diode (LED) packages face challenges in achieving desired light output and economic feasibility due to the separation of LED chips, which limits their ability to act as a single integrated light source and complicates mounting and connection processes.
Innovation Solution
A multi-chip LED package design where at least three LED chips are mounted close to each other on a substrate with specific terminal arrangements and wire connections, allowing individual operation while forming a single integrated light source, and utilizing a light transmitting encapsulation material for effective color mixing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple LED chips are mounted on different terminals within a single LED package, then individual operation of LED chips is enabled, but the chips must be separated by long distances which complicates mounting and connection processes
Solution Approach 1:
The invention divides the electrical connection system into two independent lead systems: first leads that directly mount LED chips on their terminals, and second leads that connect to LED chips via wires. This segmentation allows chips to be positioned close together while maintaining independent electrical connections, resolving the contradiction between close spacing and individual operation capability.
Solution Approach 2:
The second leads act as intermediaries between the mounting structure and the LED chips. By using wire connections through second leads, the patent enables flexible electrical connection without requiring direct terminal mounting, thus allowing chips to be positioned closer together while still enabling individual operation through separate electrical pathways.
2Illumination intensity
If multiple LED packages are integrated into a single light emitting module, then desired light output is achieved, but the LED chips are separated by long distances and cannot act as a single integrated light source
Solution Approach 1:
The invention merges multiple LED chips into a single package structure with unified optical characteristics. By positioning multiple chips close together on the same substrate and using a common lens, the system achieves high light output while maintaining the coherence of a single integrated light source, eliminating the need for multiple separate packages.
Solution Approach 2:
The invention transitions from a single-chip vertical structure to a multi-chip planar arrangement. By arranging multiple LED chips side-by-side on the substrate in a horizontal dimension rather than stacking them vertically or using separate packages, the system achieves both high light output and integrated light source characteristics.
3Adaptability or versatility
If three or more LED chips are individually operated, then versatile light control is achieved, but the arrangement and terminal patterns become too complicated for practical use
Solution Approach 1:
The invention segments the electrical connection function into two independent systems: first leads for direct mounting connections and second leads for wire-based connections. This dual-lead segmentation simplifies the terminal pattern design, making it feasible to manufacture packages with three or more individually controllable LED chips without excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the LED package to emit light with various colors while maintaining individual chip operation, improving luminous efficacy and simplifying mounting and connection processes.
Implementation Method 1
utilizing a light transmitting encapsulation material for effective color mixing
Data Source
AI summary
An embodiment of the invention provides a light emitting diode package. The light emitting diode package includes at least three light emitting diode chips; first leads comprising at least three chip mounting sections on which the at least three light emitting diode chips are mounted, respectively; second leads separated from the first leads and connected to the light emitting diode chips via wires, respectively; and a substrate having the first leads and the second leads formed thereon, wherein the at least three chip mounting sections are arranged around a center of the substrate through which an optical axis of the light emitting diode package passes.