LED Package Cavity Structure for Lens Bonding and Short Isolation
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Solution Overview
Problem
Light emitting diode packages face issues with reliability and efficiency due to lens cracking and electrical failures over time, which affect their performance and lifespan.
Innovation Solution
A light emitting diode package design featuring a substrate with a sidewall forming a cavity, where the sidewall's inner side surfaces form angles of 90 degrees or more, and an insulating region separates interconnect patterns, with a bonding agent and short preventing portions like grooves or dams to secure the lens and prevent electrical shorts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional light emitting diode package structure is used, then the device can emit light efficiently, but the lens deteriorates over time causing cracks and separation from the housing
Solution Approach 1:
The housing is divided into a body and a separate lens component that can be independently replaced. The lens is detachably coupled to the body through a lens coupling structure, allowing the lens to be segmented from the housing for individual maintenance without replacing the entire device.
Solution Approach 2:
A lens coupling structure is pre-formed on the housing before the lens is attached. This coupling structure includes a lens coupling hole with a lens receiving portion and a lens protrusion that fits into a corresponding recess, creating a preliminary mechanical interface that prevents future lens separation and cracking.
2Area of stationary object
If interconnect patterns are placed close together to reduce device size, then the package becomes more compact, but electrical shorts may occur between patterns
Solution Approach 1:
An insulating layer is introduced as an intermediary substance between adjacent interconnect patterns on the substrate. This insulating layer electrically isolates the conductive patterns from each other, preventing electrical shorts while allowing the patterns to be placed close together for compact packaging.
3Reliability
If the lens is tightly secured to the housing to prevent separation, then reliability improves, but the lens may crack under thermal or mechanical stress
Solution Approach 1:
The lens coupling structure provides localized bonding at specific interfaces (lens protrusion fitting into lens coupling hole) rather than requiring uniform adhesion across the entire lens surface. This concentrated bonding approach maintains strong attachment while reducing overall stress distribution on the lens material.
Data Source
AI summary
Disclosed is a light emitting diode package. According to one embodiment, the light emitting diode package includes a body and a light emitting diode chip. The body includes a substrate and a sidewall formed on the substrate and may be formed with a cavity therein. The light emitting diode chip may be mounted on the substrate in the cavity of the body. The sidewall may include multiple inner side surfaces formed to surround the cavity. The inner side surfaces of the sidewall may include adjacent inner side surfaces forming an angle of 90 degrees or more therebetween. In addition, the substrate may include an insulating base, a first interconnect pattern formed on the base, a second interconnect pattern spaced apart from the first interconnect pattern, and an insulating region disposed inside the cavity to separate the first interconnect pattern from the second interconnect pattern.