LED Package Heat Dissipation via Side-View Electrode Exposure
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Solution Overview
Problem
Conventional LED package manufacturing methods result in reduced heat-dissipating efficiency due to limited heat dissipation from exposed electrode ends, leading to a shortened lifespan of LED packages.
Innovation Solution
A method involving an engaging frame with metallic lead frames and insulating parts, where the substrate and engaging frame are aligned and combined to create a packaging structure with increased heat-dissipating surfaces, allowing for efficient heat dissipation through exposed side faces of electrodes and inserting parts when mounted on a printed circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional LED package manufacturing method is used, then the structure is simple, but the heat-dissipating efficiency is reduced
Solution Approach 1:
The patent transitions from traditional top-view mounting to side-view mounting configuration. The LED chip is mounted on the side face of the substrate rather than the top surface, and the light emitting direction is parallel to the extension direction of the printed circuit board. This dimensional change allows heat to be dissipated through the side faces of the electrodes and inserting parts, significantly increasing the heat-dissipating surface area while maintaining manufacturing feasibility
Solution Approach 2:
The patent divides the heat dissipation function into multiple segments: the substrate provides a mounting surface, the engaging frame with lead frames provides additional heat dissipation paths through its lead frames, and the inserting parts provide further heat dissipation surfaces. By segmenting the heat dissipation function across multiple components, the overall heat-dissipating efficiency is improved without significantly complicating the manufacturing process
2Illumination intensity
If power of LED package is increased, then the luminosity is improved, but the heat generated is increased and lifespan is shortened
Solution Approach 1:
The side-view mounting configuration enables heat to be dissipated through the side faces of the electrodes and inserting parts in addition to the traditional top and bottom surfaces. This dimensional change in heat dissipation geometry allows higher power LEDs to operate without excessive temperature rise, thereby extending lifespan while maintaining high luminosity
Solution Approach 2:
The engaging frame with lead frames acts as an intermediary heat dissipation structure. The lead frames provide additional thermal conduction paths from the LED chip to the printed circuit board, serving as a mediator to transfer heat away from the LED package more effectively, thus enabling higher power operation with extended lifespan
3Device complexity
If heat dissipation is limited to exposed ends of electrodes, then the structure is simple, but the heat-dissipating efficiency is decreased
Solution Approach 1:
The patent expands heat dissipation from one-dimensional (exposed ends of electrodes) to three-dimensional (side faces of electrodes, inserting parts, and lead frames). By utilizing the side faces and multiple components in the heat dissipation path, the effective heat-dissipating surface area is dramatically increased without proportionally increasing structural complexity
Solution Approach 2:
The engaging frame and inserting parts serve multiple functions: they provide mechanical support for mounting the LED chip, electrical connection through the lead frames, and heat dissipation through their exposed surfaces. This multi-functionality allows the same components to contribute to both structural integrity and thermal management, improving heat-dissipating efficiency without significantly increasing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances heat-dissipating efficiency and extends the lifespan of LED packages by increasing the contact area and heat-dissipating area, enabling versatile mounting options and improved reliability.
Implementation Method 1
The lead frames (11) are made of metallic material, such as copper... the exposed side faces of the first and second inserting parts (135, 137) are coplanar with the exposed side faces of the first and second electrodes (131, 133), so that the contact area and heat-dissipating area are increased
Data Source
AI summary
A method for manufacturing LED packages includes following steps: providing an engaging frame including a lead frame, electrode structures having first and second electrodes, and defining slots between the electrode structure, each first electrode including a first inserting part and each second electrode including a second inserting part; providing a substrate and combining the substrate and the engaging frame together to make through holes of the substrate located at lateral sides of the first and second inserting parts respectively, insulating parts of the substrate received in the slots of the engaging frame, and cavities of the substrate receiving the first and second inserting parts; providing LED diodes, and connecting each LED diode electrically to the first and second electrodes; and cutting along the first and second inserting parts to make sides of the first and second inserting parts exposed to ambient air.