LED Package Silicon Substrate Heat Dissipation
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Solution Overview
Problem
Conventional LED packages face challenges in achieving effective heat discharge and compact size, with complex manufacturing processes that hinder the production of thin, lightweight packages suitable for miniaturized applications like LCD backlights and camera flashes.
Innovation Solution
The LED package utilizes a silicon substrate with an insulating film and electrode patterns, a spacer with a through hole for flip-chip bonding, and a planar optical element, allowing for efficient heat dissipation and compact design, with the option of using a reflective metal film for enhanced reflectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal substrate with a narrow slit is used to enhance heat discharge, then heat discharge quality is improved, but the fabrication process becomes complex and the package size increases
Solution Approach 1:
The patent extracts the heat discharge function from the substrate itself by introducing a separate heat dissipation plate. The substrate focuses on electrical and structural functions, while the heat dissipation plate handles thermal management, eliminating the need for complex substrate slits and adhesive layers.
Solution Approach 2:
The patent segments the package into distinct functional modules: substrate, heat dissipation plate, and reflective plate. This segmentation allows each component to be optimized independently and simplifies the overall fabrication process by eliminating the need for fine processing of the substrate.
2Temperature
If a metal substrate with narrow slit and multiple adhesive layers is used, then heat discharge is improved, but the package thickness increases
Solution Approach 1:
The heat discharge function is extracted from the substrate structure, eliminating the need for thick adhesive layers and complex substrate modifications. The separate heat dissipation plate provides efficient thermal management with minimal thickness addition.
3Ease of manufacture
If conventional LED package structure is used, then manufacturing is simplified, but heat discharge efficiency is insufficient for high-output LEDs
Solution Approach 1:
The package is segmented into functionally independent components, with the heat dissipation plate serving as a separate element that can be easily manufactured and assembled. This maintains manufacturing simplicity while dramatically improving heat discharge efficiency.
Solution Approach 2:
The heat dissipation plate serves multiple functions: thermal management, structural support, and electrical isolation. This multi-functionality improves heat discharge efficiency without complicating the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the production of thinner, more compact LED packages with improved heat discharge quality, simplifying the manufacturing process and facilitating mass production while maintaining high light-conversion efficiency.
Implementation Method 1
uses a silicon substrate with an insulating film and electrode patterns... allowing for efficient heat dissipation
Implementation Method 2
with the option of using a reflective metal film for enhanced reflectivity
Data Source
AI summary
The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer.