LED Package With Transparent Silicone Resin And Segmented Lead Frames
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Solution Overview
Problem
Conventional LED packages face challenges in durability due to light and heat degradation, and high production costs, especially with enclosures made of thermoplastic polyamide resin, which deteriorate quickly and require costly materials for improved performance.
Innovation Solution
The LED package design eliminates the traditional enclosure, using (2×n) or (n+1) lead frames with n LED chips, where the LED chips are connected to different lead frames, and a transparent silicone resin body covers the lead frames and chips, enhancing durability and light extraction efficiency without the need for a thermoplastic polyamide resin enclosure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an enclosure made of thermoplastic polyamide resin is used to control light distribution, then light extraction efficiency is improved, but durability deteriorates due to degradation from light and heat
Solution Approach 1:
The invention removes the traditional white resin enclosure from the LED package structure. Instead of using an enclosure to control light distribution, the patent connects LED chips directly to lead frames and seals them with transparent silicone resin, eliminating the component that degrades under light and heat exposure.
Solution Approach 2:
The invention changes the material parameter from thermoplastic polyamide resin to transparent silicone resin. This material substitution provides superior resistance to light and heat degradation while maintaining the necessary optical and sealing properties for LED package functionality.
2Reliability
If an enclosure made of thermoplastic polyamide resin is used to control light distribution, then light extraction efficiency is improved, but manufacturing cost increases
Solution Approach 1:
The invention removes the white resin enclosure component entirely, eliminating the need to source, process, and assemble this expensive material. The light distribution function is achieved through the simplified direct-mount structure with transparent silicone sealing.
Solution Approach 2:
The lead frame serves multiple functions: electrical connection, mechanical support, and heat dissipation. The transparent silicone resin provides both sealing and light transmission functions. This multi-functionality eliminates the need for separate enclosure components, reducing overall manufacturing cost.
3Device complexity
If multiple LED chips are mounted on a single lead frame, then device complexity is reduced, but heat dissipation deteriorates
Solution Approach 1:
The invention divides the LED package into multiple independent lead frame units, each carrying one or more LED chips. This segmentation creates separate heat dissipation pathways for each lead frame, preventing heat accumulation while maintaining manageable device complexity through modular construction.
4Adaptability or versatility
If LED chips are connected to different lead frames, then control versatility is improved, but device complexity increases
Solution Approach 1:
The invention segments the LED package into multiple independent lead frame units, each capable of carrying and controlling one or more LED chips. This segmentation enables independent control of different LED outputs while keeping each lead frame unit simple and manageable in size.
Solution Approach 2:
Each lead frame is designed as a universal module that can accommodate different LED chip configurations and color types. This universality allows flexible control arrangements without increasing the fundamental device complexity, as each lead frame follows the same basic structure and connection methodology.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves durability, reduces production costs, allows for independent control of LED outputs, and enhances light emission at a wide angle with improved heat dissipation and reduced risk of lead frame detachment, resulting in a reliable and cost-effective LED package.
Implementation Method 1
enhancing durability and light extraction efficiency without the need for a thermoplastic polyamide resin enclosure... improved heat dissipation
Implementation Method 2
n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames
Implementation Method 3
enhances light emission at a wide angle with improved heat dissipation
Data Source
AI summary
According to one embodiment, an LED package includes (2×n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2×n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2×n) lead frames and another terminal connected to each of lead frames of the (2×n) lead frames other than the n lead frames. The resin body covers the (2×n) lead frames and the n LED chips.