LED Package Single-Substrate Integration for Thickness Reduction
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Solution Overview
Problem
Conventional LED package manufacturing processes result in insufficient thickness reduction and increased production costs due to wire bonding and complex substrate stacking methods.
Innovation Solution
An LED package design featuring a substrate with positive and negative contacts on the same side, an insulated layer, and a fluorescent adhesive layer, manufactured using a simplified process involving cavity formation, electroplating, and hot-pressing of solder layers to connect the LED chip, reducing the need for wire bonding and dual substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect LED chip to substrate, then electrical connection is achieved, but package thickness cannot be reduced effectively
Solution Approach 1:
The patent extracts and eliminates the wire bonding process from the traditional LED packaging structure. Instead of using separate wires to connect the LED chip to the substrate, the electrical connection is achieved through direct contact between the LED chip terminals and the contact pads on the substrate, thereby removing the thickness contribution of wire bonding layers.
Solution Approach 2:
The patent merges the electrical connection function with the substrate structure itself. The substrate is designed with integrated contact pads that directly receive and electrically connect to the LED chip terminals, combining the connection function into the substrate rather than using separate wire bonding components.
2Length of stationary object
If dual substrates with redistribution layer are used, then package thickness is reduced, but manufacturing process becomes complicated and production cost increases
Solution Approach 1:
The patent extracts and eliminates the complex dual-substrate structure with redistribution layers. Instead, it uses a single substrate with optimized contact pad arrangement that achieves the same thickness reduction goal without requiring multiple substrate layers or complex redistribution routing.
Solution Approach 2:
Instead of reducing thickness by stacking multiple substrates vertically (the conventional approach), the patent inverts the approach by using a single substrate with laterally arranged contact pads, achieving thickness reduction through planar optimization rather than vertical stacking.
3Length of stationary object
If dual substrates with redistribution layer are used, then package thickness is reduced, but production cost increases
Solution Approach 1:
The patent extracts and removes the expensive dual-substrate manufacturing process. By using a single substrate with directly integrated contact pads, it eliminates the need for complex multi-layer substrate fabrication, copper redistribution layer deposition, and associated high-cost manufacturing steps.
Solution Approach 2:
The patent adopts a simpler, more cost-effective single-substrate design that can be manufactured using standard, lower-cost processes. This approach sacrifices the reusability and modularity of dual-substrate designs but achieves the goal of thickness reduction through more economical manufacturing methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces production costs and package thickness while simplifying the manufacturing process, achieving more efficient LED package construction with single-substrate integration and enhanced luminous efficiency.
Implementation Method 1
electroplating an electrically-conductive layer to the negative contact zone; electroplating two solder layers to the positive contact zone and a surface of the electrically-conductive layer
Implementation Method 2
hot-pressing the LED chip to melt the two solder layers to further fasten the positive and negative terminals of the LED chip to the positive and negative contacts
Data Source
AI summary
A LED package is formed of a substrate, an LED chip, an insulated layer, and a fluorescent adhesive layer. The substrate includes a positive contact and a negative contact. The LED chip is fixed to the substrate and includes a positive terminal and a negative terminal, the former of which is electrically connected with the positive contact and latter is electrically connected with the negative contact. The insulated layer is mounted to the surface of the substrate and surrounds the LED chip. The fluorescent adhesive layer is mounted to a surface of the insulated layer and covers the LED chip. In this way, the LED package can reduce the production cost and the whole size.