Light Emitting Device Package Slope Cavity Design
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Solution Overview
Problem
Light-emitting element packages experience significant light loss due to the exposure of bonding areas when connected to lead frames via wires, which affects their efficiency.
Innovation Solution
The design includes first and second lead frames electrically separated by an insulation layer, with a package body featuring a slope that defines a cavity and groove portions to expose the bonding areas at specific positions, minimizing light loss by optimizing the placement and shape of these areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bonding area of the lead frame is exposed to connect the wire, then the electrical connection is achieved, but light loss occurs due to the exposed bonding area
Solution Approach 1:
The package body is designed with differentiated local structures: a flat lower surface for light extraction and groove portions at specific locations to expose bonding areas. This allows different regions of the package body to serve different functions - the majority area optimizes light extraction while localized groove portions maintain electrical connections, thus resolving the contradiction between light efficiency and electrical connectivity.
Solution Approach 2:
The package body is segmented into functional zones: the main flat surface area dedicated to light extraction and specific groove portions dedicated to wire bonding. This segmentation allows the package to simultaneously optimize for both light emission (by maximizing the flat light-extracting surface) and electrical connection (by providing localized bonding areas in grooves), thereby reducing overall light loss while maintaining reliable electrical connections.
2Loss of energy
If the package body covers the bonding area to reduce light loss, then light extraction efficiency improves, but wire bonding becomes difficult
Solution Approach 1:
The groove portions are pre-formed in the package body at specific locations where wire bonding needs to occur. This preliminary structuring of the package body ensures that bonding areas are automatically exposed and accessible at the correct positions, making the wire bonding process easier and more reliable while maintaining the overall light extraction efficiency of the package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances light extraction efficiency by reducing the exposure of bonding areas and improving the reflection of light within the package body, leading to increased overall light emission.
Implementation Method 1
improving the reflection of light within the package body, leading to increased overall light emission
Data Source
AI summary
A light-emitting element package according to one embodiment includes first and second lead frames electrically separated from each other; a package body including a slope configured to define a cavity along with at least one of the first or second lead frame; and at least one element unit disposed in an element area of at least one of the first or second lead frame, the element unit including a light-emitting element and a protective element, wherein the package body is disposed between the protective element and the light-emitting element.