LED Package Spacing Structure for Uniform Backlight Emission

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Solution Overview

Problem

When light emitting diodes (LEDs) are used as backlight sources for display devices, such as thin film transistor-liquid crystal displays, they often suffer from uneven brightness due to the fluorescent colloid overflowing and sticking to the sidewall of the light guide plate.

Innovation Solution

The proposed LED package structure includes an electrically-insulated frame with a trough containing an LED chip and fluorescent colloid, and at least two spacing members protruding from the frame's corners. These spacing members maintain a distance from the light guide plate's sidewall, and a glue escape gap prevents the fluorescent colloid from spreading and sticking.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If the fluorescent colloid is filled in the trough to cover the LED chip, then the light emission is enhanced, but the fluorescent colloid overflows and sticks to the sidewall of the light guide plate causing uneven brightness

Engineering Contradiction:
Improvelight emissionVSAvoiduniformity of light emission
Core Design Contradiction:
Illumination intensityVSManufacturing precision

Solution Approach 1:

The patent introduces a spacing member as an intermediary element positioned between the trough and the light guide plate sidewall. This spacing member physically blocks the fluorescent colloid from contacting and adhering to the light guide plate, thereby preventing the overflow issue while maintaining adequate colloid coverage of the LED chip for proper light emission

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent segments the space around the trough by introducing discrete spacing members at specific corners. This segmentation creates isolated containment zones that control the fluorescent colloid's spread pattern, allowing the colloid to cover the LED chip effectively while being prevented from reaching the light guide plate sidewall

Inventive Principle:
Principle #1Segmentation

2Device complexity

If no spacing members are used, then the structure is simpler, but the fluorescent colloid directly adheres to the sidewall of the light guide plate

Engineering Contradiction:
Improvepackage structureVSAvoiduniformity of light emission
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The spacing member serves as a simple intermediary component that provides the necessary separation function. By placing these minimal blocking elements at key corners, the patent achieves effective colloid containment with added structural simplicity rather than requiring complex containment mechanisms

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If the spacing members are positioned at all four corners, then the fluorescent colloid is better contained, but the location-recognized corner functionality is compromised

Engineering Contradiction:
Improvecontainment of fluorescent colloidVSAvoidlocation recognition
Core Design Contradiction:
Manufacturing precisionVSLoss of information

Solution Approach 1:

The patent applies local quality by differentiating the treatment of corners based on their functional requirements. The location-recognized corner is left without a spacing member to preserve its identification function, while other corners receive spacing members for colloid containment. This selective placement optimizes both containment effectiveness and location recognition capability

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively improves the uniformity of light emission by preventing the fluorescent colloid from adhering to the light guide plate, thereby reducing the uneven brightness phenomenon in backlight modules.

Implementation Method 1

Light emitting diode is a light-emitting element made of semiconductor material that can convert electrical energy into light

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Implementation Method 2

The fluorescent colloid is filled within the trough to cover the LED chip

Methodology Applied
Scientific EffectFluorescence: Fluorescence

Data Source

PatentUS12284853B2LED package structure
Publication Date: 2025.04.22 ENNOSTAR CORP
  • US12284853B2 patent drawing
  • US12284853B2 patent drawing
  • US12284853B2 patent drawing

AI summary

A light emitting diode (LED) package structure include an electrically-insulated frame, a trough, a LED chip, a fluorescent colloid and at least two spacing members. The electrically-insulated frame has a surface with four corners. The trough is recessed in the surface. The LED chip is located in the trough. The fluorescent colloid is filled within the trough to cover the LED chip. The spacing members protrude from two of the four corners on the surface, wherein a glue escape gap is defined between each spacing member and a boundary of the trough.