LED Package Thermal Interference via Optimized Spacing

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Solution Overview

Problem

Existing light emitting device packages face thermal interference issues due to the close proximity of LEDs, which affects heat radiation efficiency and reliability, leading to potential degradation in operating characteristics and color separation when multiple packages are used.

Innovation Solution

The light emitting device package optimizes the distance between LEDs on a lead frame to be within a specific range (250 μm ± 50 μm), minimizing thermal interference while ensuring effective heat radiation and maintaining identical temperature characteristics to a single LED, thereby improving reliability and preventing color separation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple light emitting diodes are closely arranged on one lead frame to increase productivity, then the quantity of light emitting devices per package is improved, but thermal interference between LEDs increases causing heat radiation efficiency to deteriorate

Engineering Contradiction:

Improvequantity of light emitting devices per packageVSAvoidheat radiation efficiency

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent optimizes the distance parameter between adjacent LEDs to be equal to or less than the length of one side of a LED chip. This parameter optimization allows multiple LEDs to be closely arranged while maintaining proper thermal spacing, resolving the contradiction between productivity and heat radiation efficiency

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent utilizes three-dimensional space utilization by arranging LEDs in a compact configuration where the distance between adjacent LEDs is optimized in multiple directions. This dimensional optimization enables higher LED density while maintaining thermal performance through proper spatial distribution

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If the distance between light emitting diodes is reduced to minimize package size, then the volume of the package is improved, but thermal interference increases causing temperature distribution to deteriorate

Engineering Contradiction:

Improvepackage sizeVSAvoidtemperature distribution

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The patent establishes an optimal distance parameter between LEDs that is equal to or less than the side length of a LED chip. This parameter optimization achieves compact packaging while preventing excessive thermal interference, maintaining uniform temperature distribution across the package

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent replaces traditional thermal management approaches with a design-based solution by optimizing the geometric arrangement and spacing of LEDs. This structural optimization inherently manages thermal distribution without requiring additional thermal management components

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Device complexity

If light emitting diodes are arranged too closely together, then device complexity is reduced, but color separation occurs degrading manufacturing precision

Engineering Contradiction:

Improvestructure simplicityVSAvoidcolor consistency

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The patent optimizes the spacing parameter between LEDs to prevent color separation while maintaining simple device structure. By controlling the distance between adjacent LEDs to be equal to or less than the side length of a LED chip, the patent achieves both structural simplicity and color consistency

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances heat radiation efficiency and reliability by reducing thermal interference between LEDs, maintaining consistent temperature distribution and preventing color separation, thus ensuring improved performance and stability in multi-LED packages.

Implementation Method 1

Light emitting diodes (LEDs) can constitute a light source to generate light by using GaAs, AlGaAs, GaN, InGaN, and InGaAlP-based compound semiconductor materials

Methodology Applied

Scientific EffectLight emitting diode effect: Light Emitting Diode

Implementation Method 2

improving heat radiation efficiency by setting a distance between light emitting devices provided on one lead frame within a predetermined range

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS9520383B2Light emitting device package and lighting system

Publication Date: 2016.12.13 SUZHOU LEKIN SEMICON CO LTD

AI summary

Disclosed is a light emitting device package and a lighting system. The light emitting device package includes a body, a first lead frame on the body, a plurality of light emitting diodes on the first lead frame, and a molding member on the light emitting diodes. The distance between the light emitting diodes includes a distance equal to or less than a length of a first side of a first light emitting diode of the light emitting diodes.