LED Package Spacing Structure for Backlight Brightness Uniformity
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Solution Overview
Problem
The uneven brightness of backlight modules in display devices using light emitting diodes (LEDs) is a challenge due to the fluorescent colloid overflowing and adhering to the sidewall of the light guide plate, affecting uniform light emission.
Innovation Solution
The LED package structure features an electrically-insulated frame with a recessed trough for the LED chip, filled with fluorescent colloid, and protruding spacing members that maintain a distance from the light guide plate and create a glue escape gap to prevent the colloid from adhering or spreading.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the fluorescent colloid is filled in the trough to cover the LED chip, then the LED chip is properly encapsulated and protected, but the fluorescent colloid may overflow and adhere to the sidewall of the light guide plate causing uneven brightness
Solution Approach 1:
The patent introduces a spacing member as an intermediary element positioned between the fluorescent colloid and the light guide plate sidewall. This spacing member prevents direct contact and potential adhesion of the fluorescent colloid to the light guide plate, thereby eliminating the harmful effect of uneven brightness while maintaining proper LED chip encapsulation
Solution Approach 2:
The patent segments the trough structure by introducing a spacing member that divides the space between the LED package frame and the light guide plate sidewall. This segmentation creates a controlled boundary that contains the fluorescent colloid within the desired area and prevents overflow adhesion to the light guide plate
2Device complexity
If no spacing member is used, then the structure is simpler, but the fluorescent colloid directly contacts the light guide plate sidewall causing adhesion and brightness uniformity issues
Solution Approach 1:
The spacing member serves as a simple intermediary component that prevents direct contact between the fluorescent colloid and the light guide plate sidewall. This single added element effectively solves the brightness uniformity problem without significantly increasing overall device complexity
3Volume of moving object
If the spacing member is positioned close to the trough boundary, then the structure is more compact, but the fluorescent colloid can still spread through the spacing member to the light guide plate
Solution Approach 1:
The patent applies local quality by creating a specific gap distance between the spacing member and the trough boundary. This localized spatial separation ensures that the fluorescent colloid cannot spread through the spacing member to reach the light guide plate, while maintaining overall package compactness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents the fluorescent colloid from sticking to the light guide plate, improving the uniformity of light emission and reducing brightness inconsistencies in the backlight module.
Implementation Method 1
Light emitting diode is a light-emitting element made of semiconductor material that can convert electrical energy into light
Implementation Method 2
The fluorescent colloid is filled within the trough to cover the LED chip
Data Source
AI summary
A light emitting diode (LED) package structure include an electrically-insulated frame, a trough, a LED chip, a fluorescent colloid and at least two spacing members. The electrically-insulated frame has a surface with four corners. The trough is recessed in the surface. The LED chip is located in the trough. The fluorescent colloid is filled within the trough to cover the LED chip. The spacing members protrude from two of the four corners on the surface, wherein a glue escape gap is defined between each spacing member and a boundary of the trough.