LED Package Stacked Reflecting Layers Light Mixing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional light emitting diode packages in backlight modules suffer from uneven light mixing at the light guide plate, leading to the need for lengthened or thickened light guide plates to achieve uniform white light, which increases the size of the backlight module.
Innovation Solution
A light emitting diode package comprising a substrate with light emitting diode chips, a fluorescence layer, and multiple reflecting layers with high reflectivity and diffusivity, where the reflecting layers are positioned above the fluorescence layer and light emitting diode chips, and a diffusion layer with thick and thin parts to enhance light uniformity and reduce module size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the light guide plate is lengthened to provide a light mixing distance, then uniform light mixing is achieved, but the size of the backlight module increases
Solution Approach 1:
The patent transitions from achieving light mixing through horizontal extension (lengthening the light guide plate) to vertical integration by stacking multiple light emitting diode packages with different illuminating areas in the vertical direction. This dimensional change allows light mixing to occur within a compact footprint while maintaining uniformity through the stacked configuration.
Solution Approach 2:
The light emitting diode package is divided into multiple stacked layers, each containing light emitting diode chips with different illuminating areas (A1, A2, A3). This segmentation allows each layer to contribute differently to the overall light distribution, achieving uniform light mixing without requiring a long light guide plate.
2Illumination intensity
If multiple light emitting diode chips are stacked in different directions, then light beam emits in a wide angle for uniform mixing, but the light guide plate becomes thicker and the module size enlarges
Solution Approach 1:
Each light emitting diode chip in the stacked configuration is designed with a specific illuminating area (A1, A2, A3) optimized for its position and function. This local quality optimization ensures that each chip contributes effectively to uniform light mixing in its specific region, achieving overall uniformity without requiring excessive thickness or volume.
3Illumination intensity
If the light guide plate is lengthened for light mixing, then uniform white light is generated, but the productivity and compactness of the device are reduced
Solution Approach 1:
The patent merges multiple light emitting diode chips with different illuminating areas into a single integrated stacked package. This consolidation achieves uniform white light generation within a compact structure, improving device integration efficiency and productivity while eliminating the need for a lengthened light guide plate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves uniform light mixing and emission, reducing the need for larger light guide plates by using reflecting and diffusion layers to redirect and diffuse light beams, thereby improving light mixing efficiency without enlarging the module size.
Implementation Method 1
each of the reflecting layers is a diffusion reflecting layer with high reflectivity, high diffusivity and low transmittance
Implementation Method 2
The fluorescence layer covers the light emitting diode chips
Implementation Method 3
each of the reflecting layers is a diffusion reflecting layer with high reflectivity, high diffusivity and low transmittance
Data Source
AI summary
A light emitting diode package includes a substrate, a plurality of light emitting diode chips, a fluorescence layer, and a plurality of reflecting layers. The light emitting diode chips, the fluorescence layer, and the reflecting layers are disposed on the substrate. The fluorescence layer covers the light emitting diode chips, and the reflecting layers are disposed right above the light emitting diode chips, respectively.