LED Package Standby Bonding Pads for Wire-Bonding Yield
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Solution Overview
Problem
Existing LED package structures face inefficiencies in wire-bonding due to the lack of standby bonding pads, leading to increased wire-bonding time and decreased yield, as manufacturers often need to clean solder splashes before reattaching wires to the pads.
Innovation Solution
The introduction of at least two positive and negative pads for each LED chip, allowing for standby connections, enabling wires to be reconnected to alternative pads without cleaning, thus reducing wire-bonding time and enhancing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single positive pad and a single negative pad are used for each LED chip, then the device complexity is reduced, but the wire-bonding yield decreases and wire-bonding time increases when bonding failures occur
Solution Approach 1:
The patent applies preliminary action by pre-configuring standby bonding pads alongside primary bonding pads during the manufacturing process. These standby pads are prepared in advance as backup connection points, so when wire bonding fails on a primary pad, the wire can be immediately reattached to a standby pad without requiring pad cleaning or complex repair procedures, thus improving wire-bonding yield while maintaining manageable device complexity
Solution Approach 2:
The patent changes the parameter of pad quantity from one to at least two (primary plus standby) for each electrode connection. This parameter change allows the system to tolerate bonding failures by providing alternative connection points, thereby improving reliability without significantly increasing overall system complexity since the standby pads use the same structure and materials as the primary pads
2Productivity
If wire bonding failures require cleaning solder splash before reattachment, then manufacturing precision is maintained, but wire-bonding time increases and productivity decreases
Solution Approach 1:
The standby bonding pads are pre-prepared with clean surfaces during manufacturing, serving as ready-to-use alternative connection points. When wire bonding fails on a primary pad, the wire can be reattached to a standby pad without requiring cleaning operations, thus eliminating the time-consuming cleaning step while maintaining manufacturing precision through the use of freshly prepared pad surfaces
Solution Approach 2:
The patent extracts the cleaning requirement from the wire-bonding repair process by providing standby pads that do not require cleaning. The standby pads are positioned and prepared in advance, allowing failed bonds to be corrected by simply reattaching the wire to a different pad location, thereby removing the harmful time consumption and process complexity associated with cleaning operations
Data Source
AI summary
An LED package structure with standby bonding pads for increasing wire-bonding yield includes a substrate unit, a light-emitting unit, a conductive wire unit and a package unit. The substrate unit has a substrate body and a plurality of positive pads and negative pads. The light-emitting unit has a plurality of LED chips. The positive electrode of each LED chip corresponds to at least two of the positive pads, and the negative electrode of each. LED chip corresponds to at least two of the negative pads. Every two wires of the conductive wire unit are respectively electrically connected between the positive electrode of each LED chip and one of the at least two positive pads and between the negative electrode of each LED chip and one of the at least two negative pads. The package unit has a translucent package resin body on the substrate body to cover the LED chips.